Sökning: "adhesive wafer bonding"

Visar resultat 1 - 5 av 11 avhandlingar innehållade orden adhesive wafer bonding.

1. 1. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

   Författare :Niklaus Frank; KTH; []
   Nyckelord :adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

   Sammanfattning : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. LÄS MER

3. 2. Wafer-level heterogeneous integration of MEMS actuators

   Författare :Stefan Braun; Göran Stemme; Martin A. Schmidt; KTH; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; Computer engineering; Datorteknik;

   Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER

4. 3. Novel Microfluidic Devices Based on a Thermally Responsive PDMS Composite

   Författare :Björn Samel; Göran Stemme; Jörg Kutter; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; MEMS; microsystem technology; micro total analysis system; lab-on-a-chip; microfluidics; composite actuator; expandable microspheres; PDMS; poly dimethylsiloxane; disposable; wafer bonding; adhesive bonding; PDMS bonding; adhesive PDMS bonding; selective PDMS bonding; microcontact printing; Electrical engineering; Elektroteknik;

   Sammanfattning : The field of micro total analysis systems (μTAS) aims at developments toward miniaturized and fully integrated lab-on-a-chip systems for applications, such as drug screening, drug delivery, cellular assays, protein analysis, genomic analysis and handheld point-of-care diagnostics. Such systems offer to dramatically reduce liquid sample and reagent quantities, increase sensitivity as well as speed of analysis and facilitate portable systems via the integration of components such as pumps, valves, mixers, separation units, reactors and detectors. LÄS MER

5. 4. Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems

   Författare :Xiaojing Wang; Göran Stemme; Frank Niklaus; Niclas Roxhed; Shuji Tanaka; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous integration; wafer bonding; vacuum packaging; hermetic packaging; wire bonding; magnetic assembly; 2D materials; 2D heterostructures; graphene; hexagonal boron nitride h-BN ; molybdenum disulfide MoS2 ; carbon nanotubes CNTs .; Electrical Engineering; Elektro- och systemteknik;

   Sammanfattning : Heterogeneous integration realizes assembly and packaging of separately manufactured micro-components and novel functional nanomaterials onto the same substrate. It has been a key technology for advancing the discrete micro- and nano-electromechanical systems (MEMS/NEMS) devices and micro-electronic components towards cost-effective and space-efficient multi-functional units. LÄS MER

7. 5. Novel RF MEMS Switch and Packaging Concepts

   Författare :Joachim Oberhammer; KTH; []
   Nyckelord :0-level packaging; adhesive bonding; BCB; benzocyclobutene; bond strength; contact printing; film actuator; glass lid encapsulation; glass lid packaging; helium leak test; hermetic packaging; hermeticity; high isolation switch; low stress silicon nitride; low volt; TECHNOLOGY; TEKNIKVETENSKAP;

   Sammanfattning : Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. LÄS MER