Sökning: "hermetic packaging"

Visar resultat 1 - 5 av 6 avhandlingar innehållade orden hermetic packaging.

1. 1. Novel RF MEMS Switch and Packaging Concepts

   Författare :Joachim Oberhammer; KTH; []
   Nyckelord :0-level packaging; adhesive bonding; BCB; benzocyclobutene; bond strength; contact printing; film actuator; glass lid encapsulation; glass lid packaging; helium leak test; hermetic packaging; hermeticity; high isolation switch; low stress silicon nitride; low volt; TECHNOLOGY; TEKNIKVETENSKAP;

   Sammanfattning : Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. LÄS MER

3. 2. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

   Författare :Mikael Antelius; Göran Stemme; Yogesh B. Gianchandani; KTH; []
   Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; packaging; vacuum packaging; liquid encapsulation; integration; wire bonding; grating coupler; waveguide; Fabry-Perot resonator;

   Sammanfattning : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. LÄS MER

4. 3. Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems

   Författare :Xiaojing Wang; Göran Stemme; Frank Niklaus; Niclas Roxhed; Shuji Tanaka; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous integration; wafer bonding; vacuum packaging; hermetic packaging; wire bonding; magnetic assembly; 2D materials; 2D heterostructures; graphene; hexagonal boron nitride h-BN ; molybdenum disulfide MoS2 ; carbon nanotubes CNTs .; Electrical Engineering; Elektro- och systemteknik;

   Sammanfattning : Heterogeneous integration realizes assembly and packaging of separately manufactured micro-components and novel functional nanomaterials onto the same substrate. It has been a key technology for advancing the discrete micro- and nano-electromechanical systems (MEMS/NEMS) devices and micro-electronic components towards cost-effective and space-efficient multi-functional units. LÄS MER

5. 4. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems

   Författare :Simon J. Bleiker; Frank Niklaus; Gary K. Fedder; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Nano-electromechanical systems NEMS ; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; CMOS integration; Morethan- Moore MtM ; adhesive wafer bonding; NEM switch; FPGA; contact reliability; hermetic vacuum packaging; Cu low-temperature welding; through silicon vias TSVs ; magnetic self-assembly;

   Sammanfattning : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. LÄS MER

7. 5. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

   Författare :Niklaus Frank; KTH; []
   Nyckelord :adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

   Sammanfattning : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. LÄS MER