Sökning: "vacuum packaging"

Visar resultat 1 - 5 av 11 avhandlingar innehållade orden vacuum packaging.

  1. 1. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

    Författare :Mikael Antelius; Göran Stemme; Yogesh B. Gianchandani; KTH; []
    Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; packaging; vacuum packaging; liquid encapsulation; integration; wire bonding; grating coupler; waveguide; Fabry-Perot resonator;

    Sammanfattning : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. LÄS MER

  3. 2. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

    Författare :Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
    Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

    Sammanfattning : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. LÄS MER

  4. 3. Integration and Packaging Concepts for Infrared Bolometer Arrays

    Författare :Adit Decharat; Göran Stemme; Sjoerd Haasl; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fabrication; Bonding; packaging; microbolometer; Thermal imaging.; Other electrical engineering; electronics and photonics; Övrig elektroteknik; elektronik och fotonik;

    Sammanfattning :   Infrared (IR) imaging devices based on energy detection has shown a dramatic development in technology along with an impressive price reduction in recent years. However, for a low-end market as in automotive applications, the present cost of IR cameras is still the main obstacle to broadening their usage. LÄS MER

  5. 4. Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems

    Författare :Xiaojing Wang; Göran Stemme; Frank Niklaus; Niclas Roxhed; Shuji Tanaka; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous integration; wafer bonding; vacuum packaging; hermetic packaging; wire bonding; magnetic assembly; 2D materials; 2D heterostructures; graphene; hexagonal boron nitride h-BN ; molybdenum disulfide MoS2 ; carbon nanotubes CNTs .; Electrical Engineering; Elektro- och systemteknik;

    Sammanfattning : Heterogeneous integration realizes assembly and packaging of separately manufactured micro-components and novel functional nanomaterials onto the same substrate. It has been a key technology for advancing the discrete micro- and nano-electromechanical systems (MEMS/NEMS) devices and micro-electronic components towards cost-effective and space-efficient multi-functional units. LÄS MER

  7. 5. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems

    Författare :Simon J. Bleiker; Frank Niklaus; Gary K. Fedder; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Nano-electromechanical systems NEMS ; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; CMOS integration; Morethan- Moore MtM ; adhesive wafer bonding; NEM switch; FPGA; contact reliability; hermetic vacuum packaging; Cu low-temperature welding; through silicon vias TSVs ; magnetic self-assembly;

    Sammanfattning : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. LÄS MER