Sökning: "wafer-level"
Visar resultat 1 - 5 av 24 avhandlingar innehållade ordet wafer-level.
1. Wafer-level heterogeneous integration of MEMS actuators
Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER
2. Wafer-level processing of ultralow-loss Si3N4
Sammanfattning : Photonic integrated circuits (PICs) are devices fabricated on a planar wafer that allow light generation, processing, and detection. Photonic integration brings important advantages for scaling up the complexity and functionality of photonic systems and facilitates their mass deployment in areas where large volumes and compact solutions are needed, e. LÄS MER
3. MEMS-based electrochemical gas sensors and wafer-level methods
Sammanfattning : This thesis describes novel microel ectromechanical system (MEMS) based electrochemical gas sensors and methods of fabrication.This thesis presents the research in two parts. In the first part, a method to handle a thin silicon wafer using an electrochemically active adhesive is described. LÄS MER
4. Wafer-level 3-D CMOS Integration of Very-large-scale Silicon Micromirror Arrays and Room-temperature Wafer-level Packaging
Sammanfattning : This thesis describes the development of wafer-level fabrication and packaging methods for micro-electromechanical (MEMS) devices, based on wafer-bonding.The first part of the thesis is addressing the development of a wafer-level technology that allows the use of high performance materials, such as monocrystalline silicon, for MEMS devices that are closely integrated on top of sensitive integrated circuits substrates. LÄS MER
5. Heterogeneous Integration of Shape Memory Alloysfor High-Performance Microvalves
Sammanfattning : This thesis presents methods for fabricating MicroElectroMechanical System (MEMS) actuators and high-flow gas microvalves using wafer-level integration of Shape Memory Alloys (SMAs) in the form of wires and sheets. The work output per volume of SMA actuators exceeds that of other microactuation mechanisms, such as electrostatic, magnetic and piezoelectric actuation, by more than an order of magnitude, making SMA actuators highly promising for applications requiring high forces and large displacements. LÄS MER