Sökning: "electrostatic actuator"

Hittade 5 avhandlingar innehållade orden electrostatic actuator.

  1. 1. Wafer-level heterogeneous integration of MEMS actuators

    Detta är en avhandling från Stockholm : KTH

    Författare :Stefan Braun; KTH.; [2010]
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; TECHNOLOGY Information technology Computer engineering; TEKNIKVETENSKAP Informationsteknik Datorteknik;

    Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER

  2. 2. Novel RF MEMS Switch and Packaging Concepts

    Detta är en avhandling från Stockholm : KTH

    Författare :Joachim Oberhammer; KTH.; [2004]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; 0-level packaging; adhesive bonding; BCB; benzocyclobutene; bond strength; contact printing; film actuator; glass lid encapsulation; glass lid packaging; helium leak test; hermetic packaging; hermeticity; high isolation switch; low stress silicon nitride; low volt; TECHNOLOGY; TEKNIKVETENSKAP;

    Sammanfattning : Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. LÄS MER

  3. 3. High aspect ratio microsystem fabrication by ion track lithography

    Detta är en avhandling från Uppsala : Acta Universitatis Upsaliensis

    Författare :Mikael Lindeberg; Uppsala universitet.; [2003]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; Materialvetenskap; TECHNOLOGY Materials science; TEKNIKVETENSKAP Teknisk materialvetenskap; materialvetenskap; Materials Science;

    Sammanfattning : The microsystem processing of today is based on an assortment of diverse and contrasting fabrication techniques, sprung from the microelectronic industry. Microsystem technology has primarily been developed to meet the demands for scaled down low-cost sensor and actuator systems. These devices are based on a number of contrasting principles, e.g. LÄS MER

  4. 4. Microstructure technology in silicon, quartz, and diamond

    Detta är en avhandling från Uppsala : Acta Universitatis Upsaliensis

    Författare :Pelle Rangsten; Uppsala universitet.; [1999]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; Materialvetenskap; TECHNOLOGY Materials science; TEKNIKVETENSKAP Teknisk materialvetenskap; Elektronik; Electronics;

    Sammanfattning : Microstructure technology can be defined as a set of fabrication processes enabling three-dimensional structures featuring dimensions in the micrometer to millimetre range, with micrometer accuracy. Microstructures can be assembled or manufactured integrated with other structures and/or microelectronics forming complex microsystems. LÄS MER

  5. 5. Novel RF MEMS Devices for W-Band Beam-Steering Front-Ends

    Detta är en avhandling från Stockholm : KTH Royal Institute of Technology

    Författare :Nutapong Somjit; KTH.; [2012]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

    Sammanfattning : This thesis presents novel millimeter-wave microelectromechanical-systems (MEMS) components for W-band reconfigurable beam-steering front-ends. The proposed MEMS components are novel monocrystalline-silicon dielectric-block phase shifters, and substrate-integrated three-dimensional (3D) micromachined helical antennas designed for the nominal frequency of 75 GHz. LÄS MER