Sökning: "bonding"

Visar resultat 1 - 5 av 563 avhandlingar innehållade ordet bonding.

  1. 1. Plate bonding : strengthening of existing concrete structures with epoxy bonded plates of steel or fibre reinforced plastics

    Författare :Björn Täljsten; Luleå tekniska universitet; []
    Nyckelord :ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Structural Engineering; Konstruktionsteknik;

    Sammanfattning : This thesis deals with several aspects of the plate bonding problem, i.e. when steel or fibre reinforced plastics (FRP) plates are bonded to a concrete structure with the use of an epoxy adhesive. Both theoretical work and laboratory tests are presented as well as a full scale test on a strengthened concrete bridge. LÄS MER

  2. 2. Novel Microfluidic Devices Based on a Thermally Responsive PDMS Composite

    Författare :Björn Samel; Göran Stemme; Jörg Kutter; KTH; []
    Nyckelord :ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; MEMS; microsystem technology; micro total analysis system; lab-on-a-chip; microfluidics; composite actuator; expandable microspheres; PDMS; poly dimethylsiloxane; disposable; wafer bonding; adhesive bonding; PDMS bonding; adhesive PDMS bonding; selective PDMS bonding; microcontact printing; Electrical engineering; Elektroteknik;

    Sammanfattning : The field of micro total analysis systems (μTAS) aims at developments toward miniaturized and fully integrated lab-on-a-chip systems for applications, such as drug screening, drug delivery, cellular assays, protein analysis, genomic analysis and handheld point-of-care diagnostics. Such systems offer to dramatically reduce liquid sample and reagent quantities, increase sensitivity as well as speed of analysis and facilitate portable systems via the integration of components such as pumps, valves, mixers, separation units, reactors and detectors. LÄS MER

  3. 3. Wafer Bonding for Spaceflight Applications : Processing and Characterisation

    Författare :Kerstin Jonsson; Maaike Visser-Taklo; Uppsala universitet; []
    Nyckelord :ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; Engineering physics; wafer bonding; oxygen plasma; wet chemical; anodic bonding; gamma irradiation; proton irradiation; temperature cycling; vibration; shock; Weibull; adhesion quantification; double cantilever beam; tensile; chevron; blister; Teknisk fysik; Engineering physics; Teknisk fysik;

    Sammanfattning : Bonding techniques intended for assembling space microsystems are studied in this work. One of the largest problems in bonding pre-processed semiconductor wafers are the severe process restrictions imposed by material compatibility issues. LÄS MER

  4. 4. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding

    Författare :Martin Bring; Chalmers University of Technology; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer bonding; chevron notch; oxygen plasma assisted bonding; Low temperature bonding; fracture toughness;

    Sammanfattning : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. LÄS MER

  5. 5. Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems

    Författare :Xiaojing Wang; Göran Stemme; Frank Niklaus; Niclas Roxhed; Shuji Tanaka; KTH; []
    Nyckelord :ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; Micro-electromechanical systems MEMS ; heterogeneous integration; wafer bonding; vacuum packaging; hermetic packaging; wire bonding; magnetic assembly; 2D materials; 2D heterostructures; graphene; hexagonal boron nitride h-BN ; molybdenum disulfide MoS2 ; carbon nanotubes CNTs .; Electrical Engineering; Elektro- och systemteknik;

    Sammanfattning : Heterogeneous integration realizes assembly and packaging of separately manufactured micro-components and novel functional nanomaterials onto the same substrate. It has been a key technology for advancing the discrete micro- and nano-electromechanical systems (MEMS/NEMS) devices and micro-electronic components towards cost-effective and space-efficient multi-functional units. LÄS MER