Sökning: "wafer"

Visar resultat 1 - 5 av 98 avhandlingar innehållade ordet wafer.

  1. 1. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

    Detta är en avhandling från Stockholm : Signaler, sensorer och system

    Författare :Niklaus Frank; KTH.; [2002]
    Nyckelord :adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

    Sammanfattning : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. LÄS MER

  2. 2. Wafer-level heterogeneous integration of MEMS actuators

    Detta är en avhandling från Stockholm : KTH

    Författare :Stefan Braun; KTH.; [2010]
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; TECHNOLOGY Information technology Computer engineering; TEKNIKVETENSKAP Informationsteknik Datorteknik;

    Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER

  3. 3. Wafer Bonding for Spaceflight Applications Processing and Characterisation

    Detta är en avhandling från Uppsala : Acta Universitatis Upsaliensis

    Författare :Kerstin Jonsson; Uppsala universitet.; [2005]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Engineering physics; wafer bonding; oxygen plasma; wet chemical; anodic bonding; gamma irradiation; proton irradiation; temperature cycling; vibration; shock; Weibull; adhesion quantification; double cantilever beam; tensile; chevron; blister; Teknisk fysik; TECHNOLOGY Engineering physics; TEKNIKVETENSKAP Teknisk fysik;

    Sammanfattning : Bonding techniques intended for assembling space microsystems are studied in this work. One of the largest problems in bonding pre-processed semiconductor wafers are the severe process restrictions imposed by material compatibility issues. LÄS MER

  4. 4. Plasma assisted low temperature semiconductor wafer bonding

    Detta är en avhandling från Uppsala : Acta Universitatis Upsaliensis

    Författare :Donato Pasquariello; Uppsala universitet.; [2001]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; Wafer Bonding; Oxygen Plasma; InP; Si; Semiconductor; Materialvetenskap; TECHNOLOGY Materials science; TEKNIKVETENSKAP Teknisk materialvetenskap; materialvetenskap; Materials Science;

    Sammanfattning : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. LÄS MER

  5. 5. Heterogeneous Integration of Shape Memory Alloysfor High-Performance Microvalves

    Detta är en avhandling från Stockholm : KTH Royal Institute of Technology

    Författare :Henrik Gradin; KTH.; [2012]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; wafer bonding; Au-Si; eutectic bonding; release etching; electrochemical etching; microvalves; microactuators; shape memory alloy; SMA; NiTinol; TiNi; NiTi; cold-state reset; bias spring; gate valves; wire bonding;

    Sammanfattning : This thesis presents methods for fabricating MicroElectroMechanical System (MEMS) actuators and high-flow gas microvalves using wafer-level integration of Shape Memory Alloys (SMAs) in the form of wires and sheets.The work output per volume of SMA actuators exceeds that of other microactuation mechanisms, such as electrostatic, magnetic and piezoelectric actuation, by more than an order of magnitude, making SMA actuators highly promising for applications requiring high forces and large displacements. LÄS MER