Sökning: "adhesive bonding"

Visar resultat 1 - 5 av 56 avhandlingar innehållade orden adhesive bonding.

1. 1. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

   Författare :Niklaus Frank; KTH; []
   Nyckelord :adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

   Sammanfattning : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. LÄS MER

3. 2. Novel Microfluidic Devices Based on a Thermally Responsive PDMS Composite

   Författare :Björn Samel; Göran Stemme; Jörg Kutter; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; MEMS; microsystem technology; micro total analysis system; lab-on-a-chip; microfluidics; composite actuator; expandable microspheres; PDMS; poly dimethylsiloxane; disposable; wafer bonding; adhesive bonding; PDMS bonding; adhesive PDMS bonding; selective PDMS bonding; microcontact printing; Electrical engineering; Elektroteknik;

   Sammanfattning : The field of micro total analysis systems (μTAS) aims at developments toward miniaturized and fully integrated lab-on-a-chip systems for applications, such as drug screening, drug delivery, cellular assays, protein analysis, genomic analysis and handheld point-of-care diagnostics. Such systems offer to dramatically reduce liquid sample and reagent quantities, increase sensitivity as well as speed of analysis and facilitate portable systems via the integration of components such as pumps, valves, mixers, separation units, reactors and detectors. LÄS MER

4. 3. Plate bonding : strengthening of existing concrete structures with epoxy bonded plates of steel or fibre reinforced plastics

   Författare :Björn Täljsten; Luleå tekniska universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Structural Engineering; Konstruktionsteknik;

   Sammanfattning : This thesis deals with several aspects of the plate bonding problem, i.e. when steel or fibre reinforced plastics (FRP) plates are bonded to a concrete structure with the use of an epoxy adhesive. Both theoretical work and laboratory tests are presented as well as a full scale test on a strengthened concrete bridge. LÄS MER

5. 4. Wafer-level heterogeneous integration of MEMS actuators

   Författare :Stefan Braun; Göran Stemme; Martin A. Schmidt; KTH; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; Computer engineering; Datorteknik;

   Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER

7. 5. Structural adhesive bonding of metals : surface and fracture mechanics aspects

   Författare :Margareta Ring Groth; Luleå tekniska universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Manufacturing Systems Engineering; Produktionsutveckling;

   Sammanfattning : Strukturell, eller lastbärande, limning ökar alltmer i volym. Strukturell limning har tidigare mest använts i flygindustrin för lätta metaller och legeringar, men används nu inom ett flertal industrier för andra material. LÄS MER