Sökning: "Etching"
Visar resultat 6 - 10 av 247 avhandlingar innehållade ordet Etching.
6. Source and drain engineering in SiGe-based pMOS transistors
Sammanfattning : A new shallow junction formation process, based on selective silicon etching followed by selective growth of in situ B-doped SiGe, is presented. The approach is advantageous compared to conventional ion implantation followed by thermal activation, because perfectly abrupt, low resistivity junctions of arbitrary depth can be obtained. LÄS MER
7. Studies on the alpha-recoil implantation of 214Pb and 210Pb in glass surfaces,Implications for retrospective radon measurements
Sammanfattning : Glass sheets are often used in radon surveys to estimate retrospective radon concentrations, as radon progenies are embedded in the upper surface layer. The implanted activity is influenced by a variety of different environmental conditions. LÄS MER
8. Noise Aspects of some Si-based One Port Devices and Carbon Nanotubes
Sammanfattning : The p-n junctions and Schottky diodes based on Si1-xGex and SiC are of great importance in modern electronic applications, such as microwave detectors and mixers. Carbon nanotubes (CNTs) have appeared recently as an attractive new class of materials with a reduced dimensionality, and proposed as building blocks for nanoelectronic technology. LÄS MER
9. Heterogeneous Integration of Shape Memory Alloysfor High-Performance Microvalves
Sammanfattning : This thesis presents methods for fabricating MicroElectroMechanical System (MEMS) actuators and high-flow gas microvalves using wafer-level integration of Shape Memory Alloys (SMAs) in the form of wires and sheets. The work output per volume of SMA actuators exceeds that of other microactuation mechanisms, such as electrostatic, magnetic and piezoelectric actuation, by more than an order of magnitude, making SMA actuators highly promising for applications requiring high forces and large displacements. LÄS MER
10. Wafer-level heterogeneous integration of MEMS actuators
Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER