Sökning: "natural bonding"
Visar resultat 1 - 5 av 288 avhandlingar innehållade orden natural bonding.
1. The RDGT - Integration of Micromechanics and Electronics by Plasma Assisted Wafer Bonding
Sammanfattning : A high-resolution capacitive sensing technique is presented in this thesis: the Resonant Double Gate Transistor (RDGT). The major advantage of the RDGT compared to "pure" capacitive sensing techniques is its low output impedance because of the direct capacitance to current conversion of the transistor. LÄS MER
2. Bonding and Desorption Mechanismsof CO on Metal Surfaces
Sammanfattning : I have investigated two different systems CO/Fe(100) and CO/Ru(0001), toobtain new information on the binding and desorption processes. The twodifferent systems have served as a model system, one for a static examination,CO on iron, and for the dynamic case, CO on ruthenium. LÄS MER
3. Wafer Bonding - Problems and Possibilities
Sammanfattning : The wafer bonding technology offers a unique opportunity to combine different materials. This has been used for the realisation of novel silicon on insulator (SOI) structures. By replacing the buried silicon dioxide layer with a polycrystalline diamond film the thermal properties of the SOI structure are improved. LÄS MER
4. Wafer-level heterogeneous integration of MEMS actuators
Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER
5. Synthesis, Properties and Bonding in Hume-Rothery Transition-metal Gallides and Indides
Sammanfattning : In this work the intermetallic systems formed by transition-metals from group 5 to 9 with Ga, In and Zn have been experimentally and theoretically studied in detail. Syntheses, compositional analyses, X-ray and neutron diffraction (single crystal as well as powder) and measurements of physical properties, e.g. LÄS MER