Sökning: "wafer"

Visar resultat 6 - 10 av 138 avhandlingar innehållade ordet wafer.

  1. 6. Plasma assisted low temperature semiconductor wafer bonding

    Författare :Donato Pasquariello; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; Wafer Bonding; Oxygen Plasma; InP; Si; Semiconductor; Materialvetenskap; Materials science; Teknisk materialvetenskap; materialvetenskap; Materials Science;

    Sammanfattning : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. LÄS MER

  3. 7. The influence of surface microroughness on wafer bonding

    Författare :Mats Bergh; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; AFM; hydrophilic; surface roughness; diamond; silicon-on-insulator; poly silicon; silicon-on-diamons; atomic force microscope; wafer bonding; SOI; aluminum nitride; hydrophobic;

    Sammanfattning : .... LÄS MER

  4. 8. Heterogeneous Integration of Shape Memory Alloysfor High-Performance Microvalves

    Författare :Henrik Gradin; Göran Stemme; Peter Woias; KTH; []
    Nyckelord :Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; wafer bonding; Au-Si; eutectic bonding; release etching; electrochemical etching; microvalves; microactuators; shape memory alloy; SMA; NiTinol; TiNi; NiTi; cold-state reset; bias spring; gate valves; wire bonding;

    Sammanfattning : This thesis presents methods for fabricating MicroElectroMechanical System (MEMS) actuators and high-flow gas microvalves using wafer-level integration of Shape Memory Alloys (SMAs) in the form of wires and sheets. The work output per volume of SMA actuators exceeds that of other microactuation mechanisms, such as electrostatic, magnetic and piezoelectric actuation, by more than an order of magnitude, making SMA actuators highly promising for applications requiring high forces and large displacements. LÄS MER

  5. 9. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

    Författare :Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
    Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

    Sammanfattning : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. LÄS MER

  7. 10. Phenomenology of silicon wafer bonding

    Författare :Karin Ljungberg; Uppsala universitet; []
    Nyckelord :NATURAL SCIENCES; NATURVETENSKAP;

    Sammanfattning : .... LÄS MER