Sökning: "wafer"

Visar resultat 11 - 15 av 138 avhandlingar innehållade ordet wafer.

1. 11. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

   Författare :Mikael Antelius; Göran Stemme; Yogesh B. Gianchandani; KTH; []
   Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; packaging; vacuum packaging; liquid encapsulation; integration; wire bonding; grating coupler; waveguide; Fabry-Perot resonator;

   Sammanfattning : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. LÄS MER

3. 12. Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems

   Författare :Xiaojing Wang; Göran Stemme; Frank Niklaus; Niclas Roxhed; Shuji Tanaka; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous integration; wafer bonding; vacuum packaging; hermetic packaging; wire bonding; magnetic assembly; 2D materials; 2D heterostructures; graphene; hexagonal boron nitride h-BN ; molybdenum disulfide MoS2 ; carbon nanotubes CNTs .; Electrical Engineering; Elektro- och systemteknik;

   Sammanfattning : Heterogeneous integration realizes assembly and packaging of separately manufactured micro-components and novel functional nanomaterials onto the same substrate. It has been a key technology for advancing the discrete micro- and nano-electromechanical systems (MEMS/NEMS) devices and micro-electronic components towards cost-effective and space-efficient multi-functional units. LÄS MER

4. 13. Towards Unconventional Applications of Wire Bonding

   Författare :Stephan Schröder; Frank Niklaus; Michael Mayer; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; wire bonding; wire integration; transfer wafer bonding; nondispersive infrared gas sensing; low-stress packaging; shape memory alloy SMA ; infrared IR emitter; through silicon via TSV ; ethanol sensing; nitric oxide gas sensing; wafer-level; chip-level; Kanthal; nickel chromium NiCr ; Electrical Engineering; Elektro- och systemteknik;

   Sammanfattning : This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. LÄS MER

5. 14. Wafer-level processing of ultralow-loss Si3N4

   Författare :Marcello Girardi; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; waveguide; photonic integrated circuit; multilayer integration; ultralow loss; microcombs i; silicon nitride;

   Sammanfattning : Photonic integrated circuits (PICs) are devices fabricated on a planar wafer that allow light generation, processing, and detection. Photonic integration brings important advantages for scaling up the complexity and functionality of photonic systems and facilitates their mass deployment in areas where large volumes and compact solutions are needed, e. LÄS MER

7. 15. The RDGT - Integration of Micromechanics and Electronics by Plasma Assisted Wafer Bonding

   Författare :Anke Sanz-Velasco; Chalmers tekniska högskola; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; bonding; displacement measurement; oxygen plasma; low temperature wafer bonding; capacitive detection; high resolution; CMOS compatibility; MOSFET; low impedance sensing; resonant gate transistor;

   Sammanfattning : A high-resolution capacitive sensing technique is presented in this thesis: the Resonant Double Gate Transistor (RDGT). The major advantage of the RDGT compared to "pure" capacitive sensing techniques is its low output impedance because of the direct capacitance to current conversion of the transistor. LÄS MER