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1. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems
Sammanfattning : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. LÄS MER
2. Wafer-level heterogeneous integration of MEMS actuators
Sammanfattning : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. LÄS MER
3. Wafer Bonding - Problems and Possibilities
Sammanfattning : The wafer bonding technology offers a unique opportunity to combine different materials. This has been used for the realisation of novel silicon on insulator (SOI) structures. By replacing the buried silicon dioxide layer with a polycrystalline diamond film the thermal properties of the SOI structure are improved. LÄS MER
4. Wafer Bonding for Spaceflight Applications : Processing and Characterisation
Sammanfattning : Bonding techniques intended for assembling space microsystems are studied in this work. One of the largest problems in bonding pre-processed semiconductor wafers are the severe process restrictions imposed by material compatibility issues. LÄS MER
5. Oxygen plasma assisted silicon wafer bonding
Sammanfattning : .... LÄS MER