Sökning: "high frequency test"

Visar resultat 1 - 5 av 283 avhandlingar innehållade orden high frequency test.

  1. 1. Flip chip for high frequency applications : materials aspects

    Detta är en avhandling från Örebro : Örebro universitetsbibliotek

    Författare :Katarina Boustedt; Örebro universitet.; [2007]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Flip chip; underfill; bumping; microwave; gallium arsenide; high frequency; thermocompression; soldering; stud bumps; coplanar waveguide; TECHNOLOGY Electrical engineering; electronics and photonics; TEKNIKVETENSKAP Elektroteknik; elektronik och fotonik; Elektronik; Electronics;

    Sammanfattning : Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production. LÄS MER

  2. 2. ORMOCER Materials Characterization, LAP- & Micro-Processing Applied to Optical Interconnects and High-Frequency Packaging

    Detta är en avhandling från Institutionen för teknik och naturvetenskap

    Författare :Steffen Uhlig; Mats Robertsson; Peter van Daele; [2006]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Optical interconnects; Optical Backplanes; ORMOCER; SBU-technology; high-frequency packaging; surface characterization; TECHNOLOGY Electrical engineering; electronics and photonics; TEKNIKVETENSKAP Elektroteknik; elektronik och fotonik;

    Sammanfattning : ORMOCERR®s are organic-inorganic hybrid polymers. Since their material properties can be tailored precisely during synthesis, they are suitable for a wide range of applications in dielectric and optical microelectronics. LÄS MER

  3. 3. Silicon nanowire based devices for More than Moore Applications

    Detta är en avhandling från Stockholm, Sweden : KTH Royal Institute of Technology

    Författare :Ganesh Jayakumar; KTH.; [2018]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; silicon nanowire; biosensor; CMOS; sequential integration; lab-on-chip; LOC; high-K; high-K integration on SiNW biosensor; ALD; fluid gate; back gate; SiNW; SiNW pixel matrix; FEOL; pattern transfer lithography; sidewall transfer lithography; STL; multi-target bio detection; BEOL; nanonets; silicon nanonets; SiNN-FET; SiNW-FET; CMOS integration of nanowires; CMOS integration of nanonets; monolithic 3D integration of nanowires; above-IC integration of nanowires; DNA detection using SiNW; SiNW biosensor; dry environment DNA detection; DNA hybridization detection using SiNW; SiNW functionalization; SiNW silanization; SiNW grafting; FEOL integration of SiNW; BEOL integration of SiNW; sequential multiplexed biodetection; biodetection efficiency of SiNW; front end of line integration of SiNW; back end of line integration of SiNW; SiNW dry environment functionalization; APTES cross-linker; accessing SiNW test site; fluorescence microscopy of SiNW; geometry of SiNW; SiNW biosensor variability; top-down fabrication of SiNW; bottom-up fabrication of SiNW; VLS method; ams foundry CMOS process; adding functionality in BEOL process; sensor integration in BEOL process; hafnium oxide; HfO2; aluminium oxide; Al2O3; TiN backgate; Nickel source drain; ISFET; ion sensitive field effect transistor; Overcoming Nernst limit of detection using SiNW; SiNW sub-threshold region operation; ASIC; SOC; SiGe selective epitaxy; epitaxial growth of SiNW; epitaxial growth of nanowires; epitaxial growth of nanonets; nickel silicide contacts; salicide process; high yield SiNW fabrication; high volume SiNW fabrication; silicon ribbon; SiRi pixel; SiRi biosensor; SiRi DNA detection; monolithic 3D integration of nanonets; above-IC integration of nanonets; impact of back gate voltage on silicon nanowire; impact of back gate voltage on SiNW; FDSOI; fully depleted silicon on insulator technology; metal backgate; wafer scale integration of SiNW; wafer scale integration of nanonets; impact of backgate voltage on CMOS inverter circuit; frequency divider; D flip-flop; Informations- och kommunikationsteknik; Information and Communication Technology;

    Sammanfattning : Silicon nanowires (SiNW) are in the spotlight for a few years in the research community as a good candidate for biosensing applications. This is attributed to their small dimensions in nanometer scale that offers high sensitivity, label-free detection and at the same time utilizing small amount of sample. LÄS MER

  4. 4. Hydropower generator and power system interaction

    Detta är en avhandling från Uppsala : Acta Universitatis Upsaliensis

    Författare :Johan Bladh; Uppsala universitet.; [2012]
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Amortisseur windings; applied voltage test; automatic voltage regulators; damper windings; damping torque; empirical modelling; equivalent circuits; excitation control; finite element method; hydropower generators; power system restoration; power system stability; synchronous machines; self excitation; shaft torque amplification; short circuit test; single machine infinite bus; slip test; standstill frequency response test; subsynchronous oscillations; synchronising torque; synchronous generators; torsional interaction.; Engineering Science with specialization in Science of Electricity; Teknisk fysik med inriktning mot elektricitetslära;

    Sammanfattning : After decades of routine operation, the hydropower industry faces new challenges. Large-scale integration of other renewable sources of generation in the power system accentuates the role of hydropower as a regulating resource. LÄS MER

  5. 5. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing

    Detta är en avhandling från Linköping : Linköpings universitet

    Författare :Steffen Uhlig; Linköpings universitet.; Linköpings universitet.; [2003]
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; optical interconnects; overview opto coupling components; overview planar waveguide amplifiers; large area panel processing; polymer waveguides; multilayer thin film technology; ORMOCER®; sequential build up; permittivity; dielectric loss;

    Sammanfattning : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. LÄS MER