Hittade 3 avhandlingar innehållade ordet underfill.
Sammanfattning : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. LÄS MER
- Detta är en avhandling från Örebro : Örebro universitetsbibliotek
Sammanfattning : Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production. LÄS MER
- Detta är en avhandling från Stockholm : KTH Royal Institute of Technology
Sammanfattning : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. LÄS MER