Sökning: "Rao Tummala"

Hittade 1 avhandling innehållade orden Rao Tummala.

  1. 1. Flip chip for high frequency applications : materials aspects

    Författare :Katarina Boustedt; Dag Stranneby; Rao Tummala; Örebro universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Flip chip; underfill; bumping; microwave; gallium arsenide; high frequency; thermocompression; soldering; stud bumps; coplanar waveguide; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik; Elektronik; Electronics;

    Sammanfattning : Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production. LÄS MER