Sökning: "stud bumps"
Hittade 2 avhandlingar innehållade orden stud bumps.
1. Flip chip for high frequency applications : materials aspects
Sammanfattning : Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production. LÄS MER
2. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor
Sammanfattning : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. LÄS MER
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