Sökning: "through silicon via TSV"

Visar resultat 1 - 5 av 9 avhandlingar innehållade orden through silicon via TSV.

1. 1. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

   Författare :Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
   Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

   Sammanfattning : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. LÄS MER

3. 2. Towards 3D Integration of Carbon Based Electronics

   Författare :Wei Mu; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer; carbon nanomaterials; polymer filling; MWCNTs; interconnect; 3D integration; packaging; graphene; horizontally aligned SWCNTs; through silicon via;

   Sammanfattning : Carbon-based nanomaterials such as carbon nanotubes (CNTs) and graphene, which possess superior electrical, thermal and mechanical properties, have been proposed as alternative materials for future electronics. The proposed applications span from the device level, replacing silicon-based transistors, with single-walled carbon nanotubes (SWCNTs) or graphene, to packaging level using multi-walled carbon nanotubes (MWCNTs) for interconnects. LÄS MER

4. 3. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

   Författare :Shuangxi Sun; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

   Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER

5. 4. System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits

   Författare :Roshan Weerasekera; Hannu Tenhunen; Li-Rong Zheng; Atila Alvandpour; KTH; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Interconnects; Parasitic Extraction; Repeaters; Signal Integrity; System-on-Chip SoP ; System-in-Package SiP ; System-on-Package SoP ; Three-dimensional 3-D Integration; Through-Silicon-Via TSV ; Vertical Integration; Information technology; Informationsteknik;

   Sammanfattning : Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. Significant research effort spanning many decades has been expended on traditional VLSI integration technologies, encompassing process, circuit and architectural issues to tackle these problems. LÄS MER

7. 5. Characterization of Nanomaterials for Interconnect and Thermal Management in Electronic Packaging

   Författare :Si Chen; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; heat dissipation; electronic packaging; nanomaterial; characterization; thermal interface material; solder; thermoelectric.; interconnect; through silicon via;

   Sammanfattning : Electronic packaging, protecting the fragile chip from atmosphere and providing the paths for signal transmission as well as heat dissipation, is one of the most important parts in electronic devices. The cost, dimensions, performance, and reliability of an electronic device therefore strongly depend on its packaging structures and materials. LÄS MER