Sökning: "Roshan Weerasekera"

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  1. 1. System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits

    Författare :Roshan Weerasekera; Hannu Tenhunen; Li-Rong Zheng; Atila Alvandpour; KTH; []
    Nyckelord :NATURAL SCIENCES; NATURVETENSKAP; Interconnects; Parasitic Extraction; Repeaters; Signal Integrity; System-on-Chip SoP ; System-in-Package SiP ; System-on-Package SoP ; Three-dimensional 3-D Integration; Through-Silicon-Via TSV ; Vertical Integration; Information technology; Informationsteknik;

    Sammanfattning : Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. Significant research effort spanning many decades has been expended on traditional VLSI integration technologies, encompassing process, circuit and architectural issues to tackle these problems. LÄS MER