Sökning: "electronic packaging"

Visar resultat 1 - 5 av 90 avhandlingar innehållade orden electronic packaging.

  1. 1. Alternative electronic packaging concepts for high frequency electronics

    Författare :Wolfgang Peter Siebert; Sture Petersson; Shaofang Gong; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrical engineering; Connector; cooling; electronic; elastomer interconnect; EMC; shielded enclosure; high frequency; PCB; PWB; reverberation chamber; seams; soldering; twisted pair cable; Elektroteknik; Electrical engineering; Elektroteknik;

    Sammanfattning : The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. LÄS MER

  3. 2. Carbon Nanotubes for Electronic Packaging: Growth, Novel Devices and 3D Networks

    Författare :Yifeng Fu; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; multi-scale modeling; electrospinning; microfin; PDMS; chemical vapor deposition CVD ; Carbon nanotube CNT ; double-walled CNT DWNT ; CNT covalent bonding; CNT transfer; thermal management; packaging;

    Sammanfattning : Carbon nanotubes (CNTs) have shown great potential of application in electronics because of their attractive physical properties, such as high surface-to-volume ratio, high electron mobility, high Young’s modulus, high thermal conductivity, low thermal expansion coefficient, etc. However, many obstacles are yet to be removed to use CNTs as building blocks in electronic systems. LÄS MER

  4. 3. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing

    Författare :Christian Johansson; Hjalmar Hesselbom; Linköpings universitet; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER; permittivity; sequential build up; silicone elastomer;

    Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. LÄS MER

  5. 4. Integration and Packaging Concepts for Infrared Bolometer Arrays

    Författare :Adit Decharat; Göran Stemme; Sjoerd Haasl; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fabrication; Bonding; packaging; microbolometer; Thermal imaging.; Other electrical engineering; electronics and photonics; Övrig elektroteknik; elektronik och fotonik;

    Sammanfattning :   Infrared (IR) imaging devices based on energy detection has shown a dramatic development in technology along with an impressive price reduction in recent years. However, for a low-end market as in automotive applications, the present cost of IR cameras is still the main obstacle to broadening their usage. LÄS MER

  7. 5. Gap Waveguide Technology- Electromagnetic Packaging and Transitions

    Författare :Astrid Algaba Brazalez; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; rectangular waveguide; packaging; transition; coplanar waveguide; microstrip; millimeter waves; gap waveguide; perfect magnetic conductor;

    Sammanfattning : The scarcity of available frequency bands for new wireless communication systems, as well as the growing need for higher capacity, motivates the current interest in moving upwards in frequency. The millimeter wave frequencyrange is very attractive to allocate potential commercial opportunities such as short range wireless communications that allow high-speed data/video transmission, and automotive radars for both driver assistance and increasedsafety. LÄS MER