Sökning: "heat dissipation"
Visar resultat 1 - 5 av 86 avhandlingar innehållade orden heat dissipation.
1. Clothing Evaporative Resistance: Its Measurements and Application in Prediction of Heat Strain
Sammanfattning : Clothing evaporative resistance is one of the most important inputs for both the modelling and for standards dealing with thermal comfort and heat stress. It might be determined on guarded hotplates, on sweating manikins or even on human subjects. LÄS MER
2. Graphene Heat Spreaders for Electronics Thermal Management Applications
Sammanfattning : Graphene shows great potential for applications in electronics due to its outstanding physical properties such as extremely high electron mobility, high thermal conductivity, high Young’s modulus and very high surface-to-volume ratio. Among these attractive properties, the high intrinsic thermal conductivity is a critical advantage for the application of graphene in electronics to alleviate heat dissipation problems. LÄS MER
3. Numerical Analysis of Heat Transfer and Fluid Flow in Heat Exchangers with Emphasis on Pin Fin Technology
Sammanfattning : One of the most important industrial processes is heat transfer, carried out by heat exchangers in single and multiphase flow applications. Despite the existence of well-developed theoretical models for different heat transfer mechanisms, the expanding need for industrial applications requiring the design and optimization of heat exchangers, has created a solid demand for experimental work and effort. LÄS MER
4. Resonances, dissipation and decoherence in exotic and artificial atoms
Sammanfattning : There are several reasons why exotic and artificial atoms attract the interest of different scientific communities.In exotic atoms, matter and antimatter can coexist for surprisingly long times. Thus, they present a unique natural laboratory for high precision antimatter studies. LÄS MER
5. Characterization of Nanomaterials for Interconnect and Thermal Management in Electronic Packaging
Sammanfattning : Electronic packaging, protecting the fragile chip from atmosphere and providing the paths for signal transmission as well as heat dissipation, is one of the most important parts in electronic devices. The cost, dimensions, performance, and reliability of an electronic device therefore strongly depend on its packaging structures and materials. LÄS MER