Sökning: "thin-film flip-chip"
Visar resultat 1 - 5 av 6 avhandlingar innehållade orden thin-film flip-chip.
1. Flip chip for high frequency applications : materials aspects
Sammanfattning : Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production. LÄS MER
2. Thin-film ultraviolet light-emitting diodes realized by electrochemical etching of AlGaN
Sammanfattning : Ultraviolet (UV) light sources have a direct impact on everyone’s life. They are used to sterilize surfaces as well as for water purification. In addition, they are used in green houses to enhance health-promoting substances in plants, for phototherapy to treat skin diseases, for sensing and material curing. LÄS MER
3. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate
Sammanfattning : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. LÄS MER
4. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing
Sammanfattning : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. LÄS MER
5. Fabrication of Electroacoustic Devices for Integrated Applications
Sammanfattning : Electroacoustic technology has in many ways revolutionised the wireless telecommunication industry. The IC compatible fabrication technique of thin film electroacoustic devices has so far provided a considerable increase in device performance and reduction in size. At the moment, new areas where this technology can be of use is under investigation. LÄS MER