Sökning: "system-on-a-package"

Hittade 1 avhandling innehållade ordet system-on-a-package.

1. 1. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate

   Författare :Gang Zou; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; FDTD; integrated passive components; ACA; liquid crystal polymer; FEM; flip-chip; RF; anisotropic conductive adhesive; system-in-a-package; system-on-a-package;

   Sammanfattning : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. LÄS MER