Sökning: "sequential build up"

Visar resultat 1 - 5 av 18 avhandlingar innehållade orden sequential build up.

1. 1. Silicon nanowire based devices for More than Moore Applications

   Författare :Ganesh Jayakumar; Per-Erik Hellström; Mikael Östling; Luca Selmi; KTH; []
   Nyckelord :silicon nanowire; biosensor; CMOS; sequential integration; lab-on-chip; LOC; high-K; high-K integration on SiNW biosensor; ALD; fluid gate; back gate; SiNW; SiNW pixel matrix; FEOL; pattern transfer lithography; sidewall transfer lithography; STL; multi-target bio detection; BEOL; nanonets; silicon nanonets; SiNN-FET; SiNW-FET; CMOS integration of nanowires; CMOS integration of nanonets; monolithic 3D integration of nanowires; above-IC integration of nanowires; DNA detection using SiNW; SiNW biosensor; dry environment DNA detection; DNA hybridization detection using SiNW; SiNW functionalization; SiNW silanization; SiNW grafting; FEOL integration of SiNW; BEOL integration of SiNW; sequential multiplexed biodetection; biodetection efficiency of SiNW; front end of line integration of SiNW; back end of line integration of SiNW; SiNW dry environment functionalization; APTES cross-linker; accessing SiNW test site; fluorescence microscopy of SiNW; geometry of SiNW; SiNW biosensor variability; top-down fabrication of SiNW; bottom-up fabrication of SiNW; VLS method; ams foundry CMOS process; adding functionality in BEOL process; sensor integration in BEOL process; hafnium oxide; HfO2; aluminium oxide; Al2O3; TiN backgate; Nickel source drain; ISFET; ion sensitive field effect transistor; Overcoming Nernst limit of detection using SiNW; SiNW sub-threshold region operation; ASIC; SOC; SiGe selective epitaxy; epitaxial growth of SiNW; epitaxial growth of nanowires; epitaxial growth of nanonets; nickel silicide contacts; salicide process; high yield SiNW fabrication; high volume SiNW fabrication; silicon ribbon; SiRi pixel; SiRi biosensor; SiRi DNA detection; monolithic 3D integration of nanonets; above-IC integration of nanonets; impact of back gate voltage on silicon nanowire; impact of back gate voltage on SiNW; FDSOI; fully depleted silicon on insulator technology; metal backgate; wafer scale integration of SiNW; wafer scale integration of nanonets; impact of backgate voltage on CMOS inverter circuit; frequency divider; D flip-flop; Informations- och kommunikationsteknik; Information and Communication Technology;

   Sammanfattning : Silicon nanowires (SiNW) are in the spotlight for a few years in the research community as a good candidate for biosensing applications. This is attributed to their small dimensions in nanometer scale that offers high sensitivity, label-free detection and at the same time utilizing small amount of sample. LÄS MER

3. 2. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing

   Författare :Christian Johansson; Hjalmar Hesselbom; Linköpings universitet; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER; permittivity; sequential build up; silicone elastomer;

   Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. LÄS MER

4. 3. High frequency electronic packaging and components : characterization, simulation, materials and processing

   Författare :Christian Johansson; Mats Robertsson; Li-Rong Zheng; Linköpings universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER®; permittivity; printed diode; sequential build-up; silicone elastomer; Signal processing; Signalbehandling;

   Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both high density interconnects and high frequency devices have led to the search for new materials, material combinations, methods, processes and production equipment. LÄS MER

5. 4. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing

   Författare :Steffen Uhlig; Linköpings universitet; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; optical interconnects; overview opto coupling components; overview planar waveguide amplifiers; large area panel processing; polymer waveguides; multilayer thin film technology; ORMOCER®; sequential build up; permittivity; dielectric loss;

   Sammanfattning : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. LÄS MER

7. 5. High frequency properties of electrically conductive adhesive interconnections and multilayer substrates

   Författare :Markus Dernevik; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; microwaves; sequential build-up board; electrically conductive adhesives; flip-chip; printed cirquit board; anisotropic adhesives; multilayer; interconnections; printed wire board; surface mount technology; isotopic adhesives;

   Sammanfattning : .... LÄS MER