Sökning: "package design"

Visar resultat 11 - 15 av 129 avhandlingar innehållade orden package design.

1. 11. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications

   Författare :Li-Han Hsu; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Underfill; Packaging; V-band; Fabrication; Millimeter-Waves; MMICs; 60 GHz; Multi-Chip Module; Interconnect; Organic laminate; Reliability.; Flip-Chip; Design;

   Sammanfattning : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. LÄS MER

3. 12. Mechanics and Failure in Thin Material Layers : Towards Realistic Package Opening Simulations

   Författare :Eskil Andreasson; Sharon Kao-Walter; Gabriella Bolzon; Blekinge Tekniska Högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; aluminium foil; FEM; LDPE; localisation; necking; polymer; progressive damage; semi-crystalline; simulation; virtual twin;

   Sammanfattning : The final goal of this PhD-work is an efficient and user-friendly finite element modelling strategy targeting an industrial available package opening application.  In order to reach this goal, different experimental mechanical and fracture mechanical tests were continuously refined to characterize the studied materials. LÄS MER

4. 13. What Does it Take to Get your Attention? : The influence of In-Store and Out-of-Store Factors on Visual Attention and Decision Making for Fast-moving Consumer Goods

   Författare :Poja Shams; Anders Gustafsson; Erik Wästlund; Martin Löfgren; A. Parasuraman; Karlstads universitet; []
   Nyckelord :SAMHÄLLSVETENSKAP; SOCIAL SCIENCES; point-of-purchase marketing; influencing factors; out-of-store; in-store; shelf space; product packaging; package design; visual attention; visual search; eye-tracking; process-tracing; gaze cascade model; recognition heuristic; familiarity; decision-making; decision-making process; decision-making strategies; heuristic decision-making; preference formation; information processing; Business Administration; Företagsekonomi;

   Sammanfattning : Decision making for fast-moving consumer goods involves a choice between numerous similar alternatives. Under such demanding circumstances, a decision is made for one product. The decision is dependent on the interaction between the environment and the mind of the consumer, both of which are filled with information that can influence the outcome. LÄS MER

5. 14. Concurrent chip and package design for radio and mixed-signal systems

   Författare :Meigen Shen; Li-Rong Zheng; Shaofang Gong; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; Elektronik;

   Sammanfattning : The advances in VLSI and packaging technologies enable us to integrate a whole system on a single chip (SoC) or on a package module. In these systems, analog/RF electronics, digital circuitries, and memories coexist. This new technology brings us new freedom for system integration as well as new challenges in system design and implementation. LÄS MER

7. 15. System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits

   Författare :Roshan Weerasekera; Hannu Tenhunen; Li-Rong Zheng; Atila Alvandpour; KTH; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Interconnects; Parasitic Extraction; Repeaters; Signal Integrity; System-on-Chip SoP ; System-in-Package SiP ; System-on-Package SoP ; Three-dimensional 3-D Integration; Through-Silicon-Via TSV ; Vertical Integration; Information technology; Informationsteknik;

   Sammanfattning : Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. Significant research effort spanning many decades has been expended on traditional VLSI integration technologies, encompassing process, circuit and architectural issues to tackle these problems. LÄS MER