Sökning: "growth ALD"
Visar resultat 6 - 10 av 21 avhandlingar innehållade orden growth ALD.
6. Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates
Sammanfattning : Thin films play an important role in science and technology today. By combining different materials, properties for specific applications can be optimised. LÄS MER
7. Thin Film Synthesis of Nickel Containing Compounds
Sammanfattning : Most electrical, magnetic or optical devices are today based on several, usually extremely thin layers of different materials. In this thesis chemical synthesis processes have been developed for growth of less stable and metastable layers, and even multilayers, of nickel containing compounds. LÄS MER
8. Studies on Growth of SiC and BN : from Theory and Experiments
Sammanfattning : Smaller cellular telephones and more energy-efficient windows are just two examples of technological advances which call for new materials. Materials chemists seek to develop new materials, both out of pure curiosity to see which combination of elements and structures can be obtained and in efforts to produce materials, with specific properties. LÄS MER
9. Novel concepts for advanced CMOS : Materials, process and device architecture
Sammanfattning : The continuous and aggressive dimensional miniaturization ofthe conventional complementary-metal-oxide semiconductor (CMOS)architecture has been the main impetus for the vast growth ofIC industry over the past decades. As the CMOS downscalingapproaches the fundamental limits, unconventional materials andnovel device architectures are required in order to guaranteethe ultimate scaling in device dimensions and maintain theperformance gain expected from the scaling. LÄS MER
10. Integration of thulium silicate for enhanced scalability of high-k/metal gate CMOS technology
Sammanfattning : High-k/metal gate stacks have been introduced in CMOS technology during the last decade in order to sustain continued device scaling and ever-improving circuit performance. Starting from the 45 nm technology node, the stringent requirements in terms of equivalent oxide thickness and gate current density have rendered the replacement of the conventional SiON/poly-Si stack unavoidable. LÄS MER