Sökning: "three dimensional integration"

Visar resultat 11 - 15 av 92 avhandlingar innehållade orden three dimensional integration.

  1. 11. Carbon Nanotube Based Interconnect Material for Electronic Applications

    Författare :Di Jiang; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; electrical interconnect; bump; densification; electronics packaging; carbon nanotube; three dimensional integration; flexible electronics; through silicon via; transfer;

    Sammanfattning : Carbon nanotubes (CNTs) are considered as a candidate material for future electronicinterconnect applications. This thesis summarizes the research work on thefabrication and characterization of CNT-based interconnect systems, and exploresthe possibilities of integrating CNTs into various electronic interconnect scenarios. LÄS MER

  3. 12. Digital product catalogues : an evaluation of presentation and visualization techniques

    Författare :Anders Follin; Byggnadsmekanik; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; photorealistic visualization; three-dimensional modeling; Advanced digital product catalogue; computer animation; integrated visualization information; relational database;

    Sammanfattning : This licentiate thesis concerns advanced digital product catalogues, with the main focus on product presentation. A computer based digital product catalogue opens new possibilities for advanced product presentation and integration into the existing compute environment. Several new possibilities for product presentation become available. LÄS MER

  4. 13. The mediating role of product representations. A study with three dimensional textiles in early phases of innovation

    Författare :Siw Eriksson; Chalmers tekniska högskola; []
    Nyckelord :HUMANIORA; HUMANITIES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; product representations; co-design; 3D textiles;

    Sammanfattning : Smart textiles are understood as textiles, where new functions are integrated to form a textile system that can react and interact with the environment. These new textile systems place completely new demands on the actors in the development process. LÄS MER

  5. 14. Three-dimensional forward modelling and inversion of controlled-source electromagnetic data using the edge-based finite-element method

    Författare :Paula Rulff; Thomas Kalscheuer; Michael Becken; Uppsala universitet; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Applied geophysics; Controlled-source electromagnetics; Numerical modelling; Finite-element method; Geophysical inversion; Geofysik med inriktning mot fasta jordens fysik; Geophysics with specialization in Solid Earth Physics;

    Sammanfattning : Electromagnetic geophysical methods are applied to investigate anomalous subsurface structures exhibiting contrasts in electrical resistivity, as for example in mineral exploration or geothermal areas. When evaluating electromagnetic data, one big challenge is to account for full three-dimensional measurement setups and subsurface scenarios. LÄS MER

  7. 15. Germanium layer transfer and device fabrication for monolithic 3D integration

    Författare :Ahmad Abedin; Mikael Östling; Cor Claeys; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Monolithic; sequential; 3D; silicon; germanium; wafer bonding; etch back; germanium on insulator; GOI; Ge pFET; low temperature; Sipassivation; pn junction; Kisel; germanium; epitaxi; selektiv; pn-övergång; germanium påisolator; GOI; Ge PFET; bonding; monolitisk; sekventiell; tre dimensionell; 3D; lågtemperarad;

    Sammanfattning : Monolithic three-dimensional (M3D) integration, it has been proposed,can overcome the limitations of further circuits’ performance improvementand functionality expansion. The emergence of the internet of things (IoT) isdriving the semiconductor industry toward the fabrication of higher-performancecircuits with diverse functionality. LÄS MER