Sökning: "electronics packaging"

Visar resultat 1 - 5 av 55 avhandlingar innehållade orden electronics packaging.

  1. 1. Soft Intelligence : Liquids Matter in Compliant Microsystems

    Författare :Seung Hee Jeong; Zhigang Wu; Zhi-Bin Zhang; Michael D. Dickey; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Liquid; Elastomer; Cross-linking; Liquid alloy; PDMS; Adaptability; Compliance; Interface; Patterning; Printing; Surface energy; Wetting; Composite; Modulus; Stretchability; Viscoelasticity; Thermal conductivity; Contact resistance; Adhesion; Packaging; Integration; Microsystems; Microfluidics; Strain sensor; Thermoelectrics; Inductive coupling; Wireless communication; Stretchable electron-ics; Epidermal electronics; Skin electronics; Soft robotics; Wearable electronics; Teknisk fysik med inriktning mot mikrosystemteknik; Engineering Science with specialization in Microsystems Technology; Engineering Science with specialization in Materials Science; Teknisk fysik med inriktning mot materialvetenskap;

    Sammanfattning : Soft matter, here, liquids and polymers, have adaptability to a surrounding geometry. They intrinsically have advantageous characteristics from a mechanical perspective, such as flowing and wetting on surrounding surfaces, giving compliant, conformal and deformable behavior. LÄS MER

  3. 2. System integration of electronic functionality in packaging application

    Författare :Tomas Unander; Hans-Erik Nilsson; Bengt Oelmann; Shaofang Gong; Mittuniversitetet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; sensor platform; RFID; printed electronics; moisture sensors; Electronics; Elektronik;

    Sammanfattning : Sensor applications are becoming increasingly important as products are now being requested to be more and more intelligent and safe. As the costs involved in sensor technology decrease its usage will spread to new market segments including new areas with products that have never previously used such functionalities, including, wood fibre based products for packaging, hygiene or graphical use. LÄS MER

  4. 3. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

    Författare :Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
    Nyckelord :Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

    Sammanfattning : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. LÄS MER

  5. 4. Novel RF MEMS Switch and Packaging Concepts

    Författare :Joachim Oberhammer; KTH; []
    Nyckelord :0-level packaging; adhesive bonding; BCB; benzocyclobutene; bond strength; contact printing; film actuator; glass lid encapsulation; glass lid packaging; helium leak test; hermetic packaging; hermeticity; high isolation switch; low stress silicon nitride; low volt; TECHNOLOGY; TEKNIKVETENSKAP;

    Sammanfattning : Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. LÄS MER

  7. 5. Integration and Packaging Concepts for Infrared Bolometer Arrays

    Författare :Adit Decharat; Göran Stemme; Sjoerd Haasl; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fabrication; Bonding; packaging; microbolometer; Thermal imaging.; Other electrical engineering; electronics and photonics; Övrig elektroteknik; elektronik och fotonik;

    Sammanfattning :   Infrared (IR) imaging devices based on energy detection has shown a dramatic development in technology along with an impressive price reduction in recent years. However, for a low-end market as in automotive applications, the present cost of IR cameras is still the main obstacle to broadening their usage. LÄS MER