Sökning: "electrical interconnect"

Visar resultat 1 - 5 av 87 avhandlingar innehållade orden electrical interconnect.

1. 1. Carbon Nanotube Based Interconnect Material for Electronic Applications

   Författare :Di Jiang; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; electrical interconnect; bump; densification; electronics packaging; carbon nanotube; three dimensional integration; flexible electronics; through silicon via; transfer;

   Sammanfattning : Carbon nanotubes (CNTs) are considered as a candidate material for future electronicinterconnect applications. This thesis summarizes the research work on thefabrication and characterization of CNT-based interconnect systems, and exploresthe possibilities of integrating CNTs into various electronic interconnect scenarios. LÄS MER

3. 2. Vertically Aligned Carbon Nanotubes for Electrical Interconnect

   Författare :Di Jiang; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

   Sammanfattning : .... LÄS MER

4. 3. Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics Packaging

   Författare :Si Chen; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Carbon nanofibers; Fracture surface; Electronics packaging; Thermal fatigue; Electrical resistance; Shear strength; Interconnect materials; Nanocomposite solder;

   Sammanfattning : In the electronics industry, packaging is responsible to protect chip from atmosphere and provide the path for signal communication as well as thermal dissipation. The realization of these functions in a packaging system depends on the performance of interconnect materials. Any failure on the interconnect materials could make entire system down. LÄS MER

5. 4. Alternative electronic packaging concepts for high frequency electronics

   Författare :Wolfgang Peter Siebert; Sture Petersson; Shaofang Gong; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrical engineering; Connector; cooling; electronic; elastomer interconnect; EMC; shielded enclosure; high frequency; PCB; PWB; reverberation chamber; seams; soldering; twisted pair cable; Elektroteknik; Electrical engineering; Elektroteknik;

   Sammanfattning : The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. LÄS MER

7. 5. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications

   Författare :Li-Han Hsu; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Underfill; Packaging; V-band; Fabrication; Millimeter-Waves; MMICs; 60 GHz; Multi-Chip Module; Interconnect; Organic laminate; Reliability.; Flip-Chip; Design;

   Sammanfattning : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. LÄS MER