Sökning: "Cooling package"

Visar resultat 1 - 5 av 13 avhandlingar innehållade orden Cooling package.

  1. 1. Investigation of Rear-Mounted Cooling Module Installations for Heavy Vehicles

    Författare :Lisa Larsson; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Cooling package; Aerodynamics; Heat transfer; CFD;

    Sammanfattning : Due to stricter emissions legislations and increasing fuel prices vehicle efficiency must be improved. A trend that has been seen during recent years is increased engine power for many vehicle segments. Different exhaust gas after-treatment systems have also been introduced to be able to meet the emission demands. LÄS MER

  3. 2. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate

    Författare :Gang Zou; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; FDTD; integrated passive components; ACA; liquid crystal polymer; FEM; flip-chip; RF; anisotropic conductive adhesive; system-in-a-package; system-on-a-package;

    Sammanfattning : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. LÄS MER

  4. 3. Process development and Reliability Study for System-in-a-Package by using a Liquid Crystal Polymer Substrate

    Författare :Liu Chen; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; and Adhesion; Finite Element Simulation; Embedded Active and Passives Technology; System-in-a-Package; Liquid Crystal Polymer; Electroless Copper Plating;

    Sammanfattning : System-in-a-package (SiP) aims to integrate all of the system functions within a system-level package, containing multiple ICs and other components interconnected through a high-density substrate. SiP is characterized by dividing chip functions among several smaller chips, by connecting chips in the first stage of board manufacture, and by integrating passive components in the substrate. LÄS MER

  5. 4. An experimental and numerical study of an automotive cooling module

    Författare :Anders Rynell; Gunilla Efraimsson; Michael Shur; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fan installation effects; spectral decomposition; aeroacoustics; Vehicle and Maritime Engineering; Farkostteknik;

    Sammanfattning : Heavy vehicles are major emitters of noise. Especially at idle or low vehicle speeds a large portion of the noise emanates from the fan that forces the flow through the cooling module. The aim of this work is to investigate and reveal aerodynamic and acoustic installation effects linked to the cooling package. LÄS MER

  7. 5. Computational tools for simulation of phase transformations

    Författare :Mikael Schalin; KTH; []
    Nyckelord :;

    Sammanfattning : A new software package, Thermite, for thermodynamiccalculations and process simulation is developed around theThermo-Calc databank. Thermite is a computational toolbox forequilibrium calculations and simulation of phasetransformations. It provides graphic visualisation and allowsmanipulation of the presented data. LÄS MER