Sökning: "Embedded Active and Passives Technology"

Hittade 1 avhandling innehållade orden Embedded Active and Passives Technology.

1. 1. Process development and Reliability Study for System-in-a-Package by using a Liquid Crystal Polymer Substrate

   Författare :Liu Chen; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; and Adhesion; Finite Element Simulation; Embedded Active and Passives Technology; System-in-a-Package; Liquid Crystal Polymer; Electroless Copper Plating;

   Sammanfattning : System-in-a-package (SiP) aims to integrate all of the system functions within a system-level package, containing multiple ICs and other components interconnected through a high-density substrate. SiP is characterized by dividing chip functions among several smaller chips, by connecting chips in the first stage of board manufacture, and by integrating passive components in the substrate. LÄS MER