Sökning: "System-in-a-Package"

Visar resultat 1 - 5 av 7 avhandlingar innehållade ordet System-in-a-Package.

  1. 1. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate

    Författare :Gang Zou; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; FDTD; integrated passive components; ACA; liquid crystal polymer; FEM; flip-chip; RF; anisotropic conductive adhesive; system-in-a-package; system-on-a-package;

    Sammanfattning : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. LÄS MER

  3. 2. Process development and Reliability Study for System-in-a-Package by using a Liquid Crystal Polymer Substrate

    Författare :Liu Chen; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; and Adhesion; Finite Element Simulation; Embedded Active and Passives Technology; System-in-a-Package; Liquid Crystal Polymer; Electroless Copper Plating;

    Sammanfattning : System-in-a-package (SiP) aims to integrate all of the system functions within a system-level package, containing multiple ICs and other components interconnected through a high-density substrate. SiP is characterized by dividing chip functions among several smaller chips, by connecting chips in the first stage of board manufacture, and by integrating passive components in the substrate. LÄS MER

  4. 3. Adhesion characterization and reliability modelling for system-in-a-package using a liquid crystal polymer substrate

    Författare :Liu Chen; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

    Sammanfattning : .... LÄS MER

  5. 4. Characterization of RF properties for system-in-a-package and anisotropic conductive adhesive flip- chip inter connection

    Författare :Gang Zou; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

    Sammanfattning : .... LÄS MER

  7. 5. Environmental Life-cycle Assessment in Microelectronics Packaging

    Författare :Anders Andrae; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; System-In-a-Package; microelectronics packaging; data collection; attributional environmental life-cycle assessment; uncertainty analysis; upstream processes; consequential life-cycle assessment; environmental life-cycle inventory; microelectronic products;

    Sammanfattning : An increased understanding of the application of environmental Life-Cycle Assessment (LCA) methodologies in the microelectronics packaging area should help in developing environmentally sound product systems. The aim of the present thesis is to increase the knowledge of using LCA tools, methods and models, in application to current and new microelectronic products. LÄS MER