Sökning: "wafer"

Visar resultat 36 - 40 av 138 avhandlingar innehållade ordet wafer.

  1. 36. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems

    Författare :Simon J. Bleiker; Frank Niklaus; Gary K. Fedder; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Nano-electromechanical systems NEMS ; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; CMOS integration; Morethan- Moore MtM ; adhesive wafer bonding; NEM switch; FPGA; contact reliability; hermetic vacuum packaging; Cu low-temperature welding; through silicon vias TSVs ; magnetic self-assembly;

    Sammanfattning : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. LÄS MER

  2. 37. Microwave CMOS LNAs and VCOs - Using Passives On-Chip, Above Chip, and Off-Chip

    Författare :Lars Aspemyr; Institutionen för elektro- och informationsteknik; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; VCO; LNA; CMOS; Wafer-Level-Packaging; Ferro-electric varactor; System-on-Package;

    Sammanfattning : The performance of LNAs and VCOs is of large importance to the complete wireless communications system. To achieve sufficient performance in microwave applications, LNAs and VCOs have therefore up to now mostly been manufactured in advanced and expensive semiconductor technologies. LÄS MER

  3. 38. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding

    Författare :Martin Bring; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer bonding; chevron notch; oxygen plasma assisted bonding; Low temperature bonding; fracture toughness;

    Sammanfattning : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. LÄS MER

  4. 39. On-chip terahertz characterisation of liquids

    Författare :Juan Cabello Sánchez; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; dielectric permittivity; Through-Reflect-Line TRL calibration; vector network analyzers VNA ; terahertz spectroscopy; isopropyl alcohol IPA ; coplanar waveguides CPW ; water; on-wafer measurements; planar Goubau line; Chip; liquids; microfluidic channels; scattering parameters; material properties;

    Sammanfattning : Spectroscopy at terahertz frequencies can be used in a wide range of applications including radio-astronomy, pharmaceutical manufacturing control, and the study of processes in molecular biology. Biomolecular samples should preferably be studied in their native environment, water, however, water poses extreme attenuation for THz-frequency waves, deteriorating or even impeding analysis using these waves. LÄS MER

  5. 40. Planar-Goubau-line components for terahertz applications

    Författare :Juan Cabello Sánchez; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; planar Goubau line; Through-Reflect-Line TRL calibration; stopband filter; on-wafer measurements; vector network analyzers VNA ; silicon membrane; power divider; Impedance-matched load; terahertz spectroscopy; microfluidic channels;

    Sammanfattning : Terahertz-wave technology has a broad range of applications, including radio astronomy, telecommunications, security, medical applications, pharmaceutical quality control, and biological sensing. However, the sources, detectors, and components are less efficient at this frequency band due to parasitic effects and increased total losses, which hinder the performance of terahertz systems. LÄS MER