Sökning: "Low temperature bonding"

Visar resultat 1 - 5 av 81 avhandlingar innehållade orden Low temperature bonding.

  1. 1. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding

    Författare :Martin Bring; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer bonding; chevron notch; oxygen plasma assisted bonding; Low temperature bonding; fracture toughness;

    Sammanfattning : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. LÄS MER

  3. 2. Plasma assisted low temperature semiconductor wafer bonding

    Författare :Donato Pasquariello; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; Wafer Bonding; Oxygen Plasma; InP; Si; Semiconductor; Materialvetenskap; Materials science; Teknisk materialvetenskap; materialvetenskap; Materials Science;

    Sammanfattning : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. LÄS MER

  4. 3. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

    Författare :Niklaus Frank; KTH; []
    Nyckelord :adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

    Sammanfattning : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. LÄS MER

  5. 4. Wafer Bonding for Spaceflight Applications : Processing and Characterisation

    Författare :Kerstin Jonsson; Maaike Visser-Taklo; Uppsala universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Engineering physics; wafer bonding; oxygen plasma; wet chemical; anodic bonding; gamma irradiation; proton irradiation; temperature cycling; vibration; shock; Weibull; adhesion quantification; double cantilever beam; tensile; chevron; blister; Teknisk fysik; Engineering physics; Teknisk fysik;

    Sammanfattning : Bonding techniques intended for assembling space microsystems are studied in this work. One of the largest problems in bonding pre-processed semiconductor wafers are the severe process restrictions imposed by material compatibility issues. LÄS MER

  7. 5. The RDGT - Integration of Micromechanics and Electronics by Plasma Assisted Wafer Bonding

    Författare :Anke Sanz-Velasco; Chalmers tekniska högskola; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; bonding; displacement measurement; oxygen plasma; low temperature wafer bonding; capacitive detection; high resolution; CMOS compatibility; MOSFET; low impedance sensing; resonant gate transistor;

    Sammanfattning : A high-resolution capacitive sensing technique is presented in this thesis: the Resonant Double Gate Transistor (RDGT). The major advantage of the RDGT compared to "pure" capacitive sensing techniques is its low output impedance because of the direct capacitance to current conversion of the transistor. LÄS MER