Sökning: "heterogeneous 3D integration"
Visar resultat 1 - 5 av 12 avhandlingar innehållade orden heterogeneous 3D integration.
1. Integration and Fabrication Techniques for 3D Micro- and Nanodevices
Sammanfattning : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. LÄS MER
2. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems
Sammanfattning : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. LÄS MER
3. Sequential 3D Integration - Design Methodologies and Circuit Techniques
Sammanfattning : Sequential 3D (S3D) integration has been identified as a potential candidate for area efficient ICs. It entails the sequential processing of tiers of devices, one on top the other. LÄS MER
4. Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems
Sammanfattning : Heterogeneous integration realizes assembly and packaging of separately manufactured micro-components and novel functional nanomaterials onto the same substrate. It has been a key technology for advancing the discrete micro- and nano-electromechanical systems (MEMS/NEMS) devices and micro-electronic components towards cost-effective and space-efficient multi-functional units. LÄS MER
5. Towards Unconventional Applications of Wire Bonding
Sammanfattning : This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. LÄS MER