Sökning: "transfer integration"

Visar resultat 26 - 30 av 196 avhandlingar innehållade orden transfer integration.

1. 26. Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems

   Författare :Xiaojing Wang; Göran Stemme; Frank Niklaus; Niclas Roxhed; Shuji Tanaka; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous integration; wafer bonding; vacuum packaging; hermetic packaging; wire bonding; magnetic assembly; 2D materials; 2D heterostructures; graphene; hexagonal boron nitride h-BN ; molybdenum disulfide MoS2 ; carbon nanotubes CNTs .; Electrical Engineering; Elektro- och systemteknik;

   Sammanfattning : Heterogeneous integration realizes assembly and packaging of separately manufactured micro-components and novel functional nanomaterials onto the same substrate. It has been a key technology for advancing the discrete micro- and nano-electromechanical systems (MEMS/NEMS) devices and micro-electronic components towards cost-effective and space-efficient multi-functional units. LÄS MER

3. 27. Adaptive time-integration for goal-oriented and coupled problems

   Författare :Peter Meisrimel; Numerisk analys; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; time-adaptivity; goal-oriented problems; error estimation; coupled problems; waveform relaxation; asynchronous methods; conjugate heat transfer;

   Sammanfattning : We consider efficient methods for the partitioned time-integration of multiphysics problems, which commonly exhibit a multiscale behavior, requiring independent time-grids. Examples are fluid structure interaction in e.g., the simulation of blood-flow or cooling of rocket engines, or ocean-atmosphere-vegetation interaction. LÄS MER

4. 28. Heat Transfer Aspects of Using Phase Change Material in Thermal Energy Storage Applications

   Författare :Justin NingWei Chiu; Viktoria Martin; Luisa Cabeza; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal energy storage; comfort cooling; phase change materials; heat transfer; Thermal energy engineering; Termisk energiteknik; Other materials science; Övrig teknisk materialvetenskap; Environmental engineering; Miljöteknik; SRA - Energy; SRA - Energi;

   Sammanfattning : Innovative methods for providing sustainable heating and cooling through thermal energy storage (TES) have gained increasing attention as heating and cooling demands in the built environment continue to climb. As energy prices continue to soar and systems reach their maximal capacity, there is an urgent need for alternatives to alleviate peak energy use. LÄS MER

5. 29. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding

   Författare :Martin Bring; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer bonding; chevron notch; oxygen plasma assisted bonding; Low temperature bonding; fracture toughness;

   Sammanfattning : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. LÄS MER

7. 30. 3D Integration of Carbon Based Electronics

   Författare :Wei Mu; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

   Sammanfattning : Carbon-based nanomaterials such as carbon nanotubes (CNTs) and graphene, which possess superior electrical, thermal and mechanical properties, have been proposed as alternative materials for future electronics. The proposed applications span from the device level, replacing silicon-based transistors, with single-walled carbon nanotubes (SWCNTs) or graphene, to packaging level using multi-walled carbon nanotubes (MWCNTs) for interconnects. LÄS MER