Sökning: "power electronics packaging"

Visar resultat 1 - 5 av 21 avhandlingar innehållade orden power electronics packaging.

  1. 1. Multiphysics Characterization of SiC Power Modules

    Författare :Yafan Zhang; Hans-Peter Nee Nee; Mietek Bakowski; Ilja Belov; Alberto Castellazzi; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Silicon carbide; power electronics; power electronics packaging; experiment; modeling and simulation; computational fluid dynamics; finite element analysis; multiphysics; Kiselkarbid; effektelektronik; effektelektronisk kapsling; experiment; modellering och simulering; flödesdynamisk numerisk modellering; finit-element-analys; multifysik; Electrical Engineering; Elektro- och systemteknik;

    Sammanfattning : This thesis proposes several novel silicon carbide power module design concepts. The goal has been to address the problems with the present designs. The electrical, thermal, and thermomechanical performances of the demonstrators have been evaluated along with presentations of methodologies of experimental and numerical characterizations. LÄS MER

  3. 2. System integration of electronic functionality in packaging application

    Författare :Tomas Unander; Hans-Erik Nilsson; Bengt Oelmann; Shaofang Gong; Mittuniversitetet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; sensor platform; RFID; printed electronics; moisture sensors; Electronics; Elektronik;

    Sammanfattning : Sensor applications are becoming increasingly important as products are now being requested to be more and more intelligent and safe. As the costs involved in sensor technology decrease its usage will spread to new market segments including new areas with products that have never previously used such functionalities, including, wood fibre based products for packaging, hygiene or graphical use. LÄS MER

  4. 3. Novel RF MEMS Switch and Packaging Concepts

    Författare :Joachim Oberhammer; KTH; []
    Nyckelord :0-level packaging; adhesive bonding; BCB; benzocyclobutene; bond strength; contact printing; film actuator; glass lid encapsulation; glass lid packaging; helium leak test; hermetic packaging; hermeticity; high isolation switch; low stress silicon nitride; low volt; TECHNOLOGY; TEKNIKVETENSKAP;

    Sammanfattning : Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. LÄS MER

  5. 4. Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics Packaging

    Författare :Si Chen; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Carbon nanofibers; Fracture surface; Electronics packaging; Thermal fatigue; Electrical resistance; Shear strength; Interconnect materials; Nanocomposite solder;

    Sammanfattning : In the electronics industry, packaging is responsible to protect chip from atmosphere and provide the path for signal communication as well as thermal dissipation. The realization of these functions in a packaging system depends on the performance of interconnect materials. Any failure on the interconnect materials could make entire system down. LÄS MER

  7. 5. Hybrid Materials for Wearable Electronics and Electrochemical Systems

    Författare :Mehmet Girayhan Say; Isak Engquist; Magnus Berggren; Shizuo Tokito; Linköpings universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Wearables; Green electronics; Organic electronics; Conductive polymers;

    Sammanfattning : Flexible electronic systems such as wearable devices, sensors and electronic skin require power sources and sensing units that are mechanically robust, operational at low bending radius, and environmentally friendly. Recently, there has been an enormous interest in active materials such as thin film semiconductors, conductive polymers, and ion-electron conductors. LÄS MER