Sökning: "Umer Shah"
Hittade 5 avhandlingar innehållade orden Umer Shah.
1. Novel RF MEMS Devices Enabled by Three-Dimensional Micromachining
Sammanfattning : This thesis presents novel radio frequency microelectromechanical (RF MEMS) circuits based on the three-dimensional (3-D) micromachined coplanar transmission lines whose geometry is re-configured by integrated microelectromechanical actuators. Two types of novel RF MEMS devices are proposed. LÄS MER
2. Silicon micromachined waveguide components for terahertz systems
Sammanfattning : This thesis presents silicon micromachined waveguide components for sub-terahertz and terahertz (THz) systems fabricated by deep reactive ion etching (DRIE). Historically the main driving force for the development of THz systems has been space-based scientific instruments for astrophysics, planetary and Earth science missions. LÄS MER
3. Exploiting the Terahertz Spectrum with Silicon Micromachining : Waveguide Components, Systems and Metrology
Sammanfattning : The terahertz spectrum (300 GHz - 3 THz) represents the final frontier for modern electronic and optical systems, wherein few low-cost, volume-manufacturable solutions exist. THz frequencies are of great scientific and commercial interest, with applications as diverse as radio astronomy, sensing and imaging and wireless communications. LÄS MER
4. Submillimeter-Wave Waveguide Frontends by Silicon-on-Insulator Micromachining
Sammanfattning : This thesis presents novel radiofrequency (RF) frontend components in the submillimeter-wave (sub-mmW) range implemented by silicon micromachining, or deep reactive ion etching (DRIE). DRIE is rapidly becoming a driving technology for the fabrication of waveguide components and systems when approaching the terahertz (THz) frequency range. LÄS MER
5. Advanced MEMS Technology for Terahertz Frequencies
Sammanfattning : With the development of terahertz (THz) technology, a variety of application demands are growing rapidly, such as high-rate communications, THz radars, environmental monitoring, medical imaging, and space exploration. However, the fabrication, integration, and packaging techniques for THz components and systems pose great challenges for a large-scale, cost-effective production. LÄS MER