Sökning: "Multi-Chip Module"

Visar resultat 6 - 7 av 7 avhandlingar innehållade orden Multi-Chip Module.

  1. 6. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate

    Författare :Gang Zou; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; FDTD; integrated passive components; ACA; liquid crystal polymer; FEM; flip-chip; RF; anisotropic conductive adhesive; system-in-a-package; system-on-a-package;

    Sammanfattning : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. LÄS MER

  3. 7. REMAP-γ: A Scalable SIMD VLSI Architecture with Hierarchical Control

    Författare :Lars Bengtsson; Chalmers tekniska högskola; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; array signal processing; hierarchical control; SIMD; VLSI architectures; distributed synchronous clocking; embedded supercomputing;

    Sammanfattning : While the clock speed of general purpose (uni-)processors has risen dramatically during recent years, this is not true for SIMD (Single Instruction stream Multiple Data streams) parallel processors. The reason is to be found in the structure of this type of architecture: long-range broadcasting of data, clock and control signals. LÄS MER