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Visar resultat 1 - 5 av 10 avhandlingar som matchar ovanstående sökkriterier.

1. 1. Efficient high-speed on-chip global interconnects

   Författare :Peter Caputa; Christer Svensson; Hartmut Grabinski; Linköpings universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Microelectronics; Global Interconnects; On-Chip Interconnects; Velocity-of-Light Delay; On-Chip Communication; Low-Latency; Transmission Lines; Electronics; Elektronik;

   Sammanfattning : The continuous miniaturization of integrated circuits has opened the path towards System-on-Chip realizations. Process shrinking into the nanometer regime improves transistor performancewhile the delay of global interconnects, connecting circuit blocks separated by a long distance, significantly increases. LÄS MER

3. 2. Design of efficient high-speed on-chip global interconnects

   Författare :Peter Caputa; Li-Rong Zheng; Linköpings universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

   Sammanfattning : The development of integrated circuits is continuously moving towards a System-on­ Chip realization where global interconnects, connecting circuit blocks separated by a long distance, have been considered a showstopper for process scaling due to their RC-delays. Our knowledge today is that high-speed interconnects must be described by models which include not only R and C, but also inductance and skin effect. LÄS MER

4. 3. System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits

   Författare :Roshan Weerasekera; Hannu Tenhunen; Li-Rong Zheng; Atila Alvandpour; KTH; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; Interconnects; Parasitic Extraction; Repeaters; Signal Integrity; System-on-Chip SoP ; System-in-Package SiP ; System-on-Package SoP ; Three-dimensional 3-D Integration; Through-Silicon-Via TSV ; Vertical Integration; Information technology; Informationsteknik;

   Sammanfattning : Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. Significant research effort spanning many decades has been expended on traditional VLSI integration technologies, encompassing process, circuit and architectural issues to tackle these problems. LÄS MER

5. 4. VCSEL Techniques for Wavelength-Multiplexed Optical Interconnects

   Författare :Mehdi Jahed; Chalmers tekniska högskola; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; silicon photonic integration; vertical-cavity surface-emitting laser; transverse and polarization mode filter; optical interconnect; distributed Bragg reflector.; wavelengthmultiplexing;

   Sammanfattning : The majority of global data communication is taking place within data centers where data is stored and processed and where the largest part of the power used for global networking is consumed. With the rapidly increasing use of Internet-based applications and services, data centers are equipped with a larger number of servers and switches requiring higher bandwidth connectivity. LÄS MER

7. 5. Wideband integrated circuits for optical communication systems

   Författare :Stavros Giannakopoulos; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; optical interconnects; SiGe HBT; receiverfront-end; VCSEL driver; wideband amplifiers; data communication; InP DHBT; TIA; distributed amplifiers.;

   Sammanfattning : The exponential growth of internet traffic drives datacenters to constantly improvetheir capacity. Several research and industrial organizations are aiming towardsTbps Ethernet and beyond, which brings new challenges to the field of high-speedbroadband electronic circuit design. LÄS MER