Sökning: "thermal resistance"

Visar resultat 31 - 35 av 363 avhandlingar innehållade orden thermal resistance.

1. 31. Evaluation of the Performances of Electrically Heated Clothing

   Författare :Faming Wang; Ergonomi och aerosolteknologi; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; electrically heated vest EHV ; heating efficiency; cold weather clothing; air velocity; clothing combination; thermal resistance; air temperature;

   Sammanfattning : Cold weather garments are necessary for people who are exposed to cold environments (below -5 °C). The weight and bulkiness of such a cold weather clothing ensemble may limit human activity and reduce the productivity. In order to solve these problems, a slim garment with a built-in heating element could be useful. LÄS MER

3. 32. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

   Författare :Shuangxi Sun; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

   Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER

4. 33. Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics Packaging

   Författare :Si Chen; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Carbon nanofibers; Fracture surface; Electronics packaging; Thermal fatigue; Electrical resistance; Shear strength; Interconnect materials; Nanocomposite solder;

   Sammanfattning : In the electronics industry, packaging is responsible to protect chip from atmosphere and provide the path for signal communication as well as thermal dissipation. The realization of these functions in a packaging system depends on the performance of interconnect materials. Any failure on the interconnect materials could make entire system down. LÄS MER

5. 34. Designing metallic glasses : Alloying, properties, and degrees of freedom

   Författare :Maciej Kaplan; Björgvin Hjörvarsson; Gunnar Pálsson; Jochen Schneider; Susanne Norgren; Uppsala universitet; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; amorphous alloys; enthalpy of mixing; glass formation; thermal stability; thermodynamics; mechanical properties; corrosion resistance; hydrogen;

   Sammanfattning : The present design rules for metallic glasses with respect to glass formation, thermal stability (resistance to crystallisation), and material properties can still be improved. A main design rule is to use thermodynamic calculations to determine the composition of eutectic points in the phase space. LÄS MER

7. 35. Heat transfer phenomena and mould flux lubrication in continuous casting of steel

   Författare :Akira Yamauchi; KTH; []
   Nyckelord :Heat Transfer; Thermal Conductivity; Contact Resistance; Mould Flux; Solidification; Lubrication; Infiltration; Friction; Shear Stress; Modeling; Crystallization; Rupture Strength; Solidus; High-Speed Casting; Viscosity; Elasticity; Uniform Cooling;

   Sammanfattning : Overall thermal resistance of the mould flux was measured tomake clear the influence of the mould flux properties on theheat transfer behavior in continuous casting, especiallythermal conductivity and the formation of air gaps in thisstudy. From the investigation of the effect of the mouldsurface temperature and physical properties of the mould fluxon heat transfer through the flux film, following knowledge hasbeen obtained. LÄS MER