Sökning: "thermal properties"
Visar resultat 31 - 35 av 1384 avhandlingar innehållade orden thermal properties.
31. Thermal conductivity of wide and ultra-wide bandgap semiconductors
Sammanfattning : This PhD thesis presents experimental and theoretical studies of the thermal conductivity of wide and ultra-wide bandgap semiconductors including GaN, AlN, β-Ga2O3 binary compounds, and AlxGa1−xN, ScxAl1−xN, YxAl1−xN ternary alloys. Thermal conductivity measurements are conducted using the transient thermoreflectance (TTR) technique and the results are interpreted using analytical models based on the solution of the Boltzmann transport equation (BTE) within the relaxation time approximation (RTA). LÄS MER
32. Functional Performance of Gadolinium Zirconate/Yttria Stabilized Zirconia Multi-Layered Thermal Barrier Coatings
Sammanfattning : Yttria stabilized zirconia (YSZ) is the state of the art ceramic top coat material used for TBC applications. The desire to achieve a higher engine efficiency of agas turbine engine by increasing the turbine inlet temperature has pushed YSZ toits upper limit. LÄS MER
33. Ice free roads using hydronic heating pavement with low temperature: Thermal properties of asphalt concretes and numerical simulations
Sammanfattning : A traditional method to mitigate the slippery conditions of a road is to spread out salt and sand on the road surface. However, salting causes corrosion on the road infrastructures, damage to surrounding vegetation and salification of fresh water. Hence, there is a need for alternative solutions to mitigate the slippery conditions. LÄS MER
34. Engineering Ceramics for Tribological Systems. Manufacture, Properties and Testing
Sammanfattning : A broad range of commercial and experimental grades of ceramics and ceramic composites was tested in various model tests and simplified component tests. The tests were done to establish important microstructural features, friction and wear mechanisms. LÄS MER
35. Solder Matrix Fiber Composite Thermal Interface Materials
Sammanfattning : Overheating has been a problem for microelectronics devices for decades, and the problem is exacerbated by the continued trend of miniaturization of features and the corresponding increase in power density. Thermal interface materials (TIMs) target one of the main bottlenecks in heat transfer: the interface between two materials, such as between a heat-generating microchip and a heatsink. LÄS MER