Sökning: "single level integration"

Visar resultat 6 - 10 av 127 avhandlingar innehållade orden single level integration.

  1. 6. Information Integration in Perception and Cognition : Exploring the Perception-Cognition Gap

    Författare :Elina Stengård; Ronald van den Berg; Adam Sanborn; Uppsala universitet; []
    Nyckelord :SAMHÄLLSVETENSKAP; SOCIAL SCIENCES; Perception; Cognition; Information integration; Judgment; Computational modeling; Bayesian inference; Psychology; Psykologi;

    Sammanfattning : Much research in both perceptual inference and cognitive inference has focused on how well human performance fares against what is considered the most optimal or rational thing to do. The verdict, however, differs between the fields. LÄS MER

  2. 7. Wideband Watt-Level Spatial Power-Combined Power Amplifier in SiGe BiCMOS Technology for Efficient mm-Wave Array Transmitters

    Författare :Artem Roev; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; integration; spatial power combining; substrate integrated waveguide; array amplifiers; RFIC;

    Sammanfattning : The continued demand for high-speed wireless communications is driving the development of integrated high-power transmitters at millimeter wave (mm-Wave) frequencies. Si-based technologies allow achieving a high level of integration but usually provide insufficient generated RF power to compensate for the increased propagation and material losses at mm-Wave bands due to the relatively low breakdown voltage of their devices. LÄS MER

  3. 8. Wireless High-Temperature Monitoring of Power Semiconductors : A Single-Chip Approach

    Författare :Joakim Nilsson; Jonny Johansson; Johan Borg; Johan Sidén; Luleå tekniska universitet; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Industrial Electronics; Industriell elektronik;

    Sammanfattning : Because failures in power electronic equipment can cause production stops and unnecessary damage to interconnected equipment, monitoring schemes that are able to predict such failures provide various economic and safety benefits. The primary motivation for this thesis is that such monitoring schemes can increase the reliability of energy production plants. LÄS MER

  4. 9. Wafer-level processing of ultralow-loss Si3N4

    Författare :Marcello Girardi; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; waveguide; photonic integrated circuit; multilayer integration; ultralow loss; microcombs i; silicon nitride;

    Sammanfattning : Photonic integrated circuits (PICs) are devices fabricated on a planar wafer that allow light generation, processing, and detection. Photonic integration brings important advantages for scaling up the complexity and functionality of photonic systems and facilitates their mass deployment in areas where large volumes and compact solutions are needed, e. LÄS MER

  5. 10. Towards 3D Integration of Carbon Based Electronics

    Författare :Wei Mu; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer; carbon nanomaterials; polymer filling; MWCNTs; interconnect; 3D integration; packaging; graphene; horizontally aligned SWCNTs; through silicon via;

    Sammanfattning : Carbon-based nanomaterials such as carbon nanotubes (CNTs) and graphene, which possess superior electrical, thermal and mechanical properties, have been proposed as alternative materials for future electronics. The proposed applications span from the device level, replacing silicon-based transistors, with single-walled carbon nanotubes (SWCNTs) or graphene, to packaging level using multi-walled carbon nanotubes (MWCNTs) for interconnects. LÄS MER