Sökning: "Electronics packaging"

Visar resultat 11 - 15 av 55 avhandlingar innehållade orden Electronics packaging.

1. 11. Carbon Nanotubes for Electronic Packaging: Growth, Novel Devices and 3D Networks

   Författare :Yifeng Fu; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; multi-scale modeling; electrospinning; microfin; PDMS; chemical vapor deposition CVD ; Carbon nanotube CNT ; double-walled CNT DWNT ; CNT covalent bonding; CNT transfer; thermal management; packaging;

   Sammanfattning : Carbon nanotubes (CNTs) have shown great potential of application in electronics because of their attractive physical properties, such as high surface-to-volume ratio, high electron mobility, high Young’s modulus, high thermal conductivity, low thermal expansion coefficient, etc. However, many obstacles are yet to be removed to use CNTs as building blocks in electronic systems. LÄS MER

3. 12. Reliability, fatigue and mechanical characterization of lead-free solders for electronic packaging applications

   Författare :Cristina Andersson; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Reliability.; Isothermal mechanical fatigue; Tensile tests; Mechanical behavior; Electronics; Thermal fatigue; Lead-free solders; Low cycle fatigue;

   Sammanfattning : The ever increasing amount of electronic waste, most of which ends up in landfills, has become a serious worldwide concern. In addition to this, the fact that Pb is highly toxic and harmful to humans has lead to the ban of this element from the electronics industry. LÄS MER

4. 13. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing

   Författare :Christian Johansson; Hjalmar Hesselbom; Linköpings universitet; []
   Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER; permittivity; sequential build up; silicone elastomer;

   Sammanfattning : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. LÄS MER

5. 14. Alternative electronic packaging concepts for high frequency electronics

   Författare :Wolfgang Peter Siebert; Sture Petersson; Shaofang Gong; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrical engineering; Connector; cooling; electronic; elastomer interconnect; EMC; shielded enclosure; high frequency; PCB; PWB; reverberation chamber; seams; soldering; twisted pair cable; Elektroteknik; Electrical engineering; Elektroteknik;

   Sammanfattning : The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. LÄS MER

7. 15. Environmental Life-cycle Assessment in Microelectronics Packaging

   Författare :Anders Andrae; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; System-In-a-Package; microelectronics packaging; data collection; attributional environmental life-cycle assessment; uncertainty analysis; upstream processes; consequential life-cycle assessment; environmental life-cycle inventory; microelectronic products;

   Sammanfattning : An increased understanding of the application of environmental Life-Cycle Assessment (LCA) methodologies in the microelectronics packaging area should help in developing environmentally sound product systems. The aim of the present thesis is to increase the knowledge of using LCA tools, methods and models, in application to current and new microelectronic products. LÄS MER