Sökning: "CNT transfer"

Visar resultat 1 - 5 av 13 avhandlingar innehållade orden CNT transfer.

1. 1. Engineering Nanofluids for Heat Transfer Applications

   Författare :Nader Nikkam; Toprak Muhammet; Mamoun Muhammed; Yulong Ding; KTH; []
   Nyckelord :nanofluid; thermal conductivity; viscosity; heat transfer; heat transfer coefficient; HTC; SiC nanoparticles; Cu nanoparticles; mesoporous silica; CNT; microwave synthesis; Kemi; Chemistry;

   Sammanfattning : Nanofluids (NFs) are nanotechnology-based colloidal dispersion prepared by dispersing nanoparticles (NPs) in conventional liquids, as the base liquid. These advanced fluids have displayed potential to enhance the performance of conventional heat transfer fluids. LÄS MER

3. 2. Carbon Nanotubes for Electronic Packaging: Growth, Novel Devices and 3D Networks

   Författare :Yifeng Fu; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; multi-scale modeling; electrospinning; microfin; PDMS; chemical vapor deposition CVD ; Carbon nanotube CNT ; double-walled CNT DWNT ; CNT covalent bonding; CNT transfer; thermal management; packaging;

   Sammanfattning : Carbon nanotubes (CNTs) have shown great potential of application in electronics because of their attractive physical properties, such as high surface-to-volume ratio, high electron mobility, high Young’s modulus, high thermal conductivity, low thermal expansion coefficient, etc. However, many obstacles are yet to be removed to use CNTs as building blocks in electronic systems. LÄS MER

4. 3. Towards Carbon Nanotube-based off-Chip Interconnects

   Författare :Teng Wang; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; densification; through silicon via TSV ; transfer; carbon nanotube CNT ; planarization; interconnect;

   Sammanfattning : .... LÄS MER

5. 4. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

   Författare :Shuangxi Sun; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

   Sammanfattning : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. LÄS MER

7. 5. Carbon Nanotube Based Interconnect Material for Electronic Applications

   Författare :Di Jiang; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; electrical interconnect; bump; densification; electronics packaging; carbon nanotube; three dimensional integration; flexible electronics; through silicon via; transfer;

   Sammanfattning : Carbon nanotubes (CNTs) are considered as a candidate material for future electronicinterconnect applications. This thesis summarizes the research work on thefabrication and characterization of CNT-based interconnect systems, and exploresthe possibilities of integrating CNTs into various electronic interconnect scenarios. LÄS MER