Sökning: "Electronics packaging"

Visar resultat 16 - 20 av 55 avhandlingar innehållade orden Electronics packaging.

1. 16. Multiphysics Characterization of SiC Power Modules

   Författare :Yafan Zhang; Hans-Peter Nee Nee; Mietek Bakowski; Ilja Belov; Alberto Castellazzi; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Silicon carbide; power electronics; power electronics packaging; experiment; modeling and simulation; computational fluid dynamics; finite element analysis; multiphysics; Kiselkarbid; effektelektronik; effektelektronisk kapsling; experiment; modellering och simulering; flödesdynamisk numerisk modellering; finit-element-analys; multifysik; Electrical Engineering; Elektro- och systemteknik;

   Sammanfattning : This thesis proposes several novel silicon carbide power module design concepts. The goal has been to address the problems with the present designs. The electrical, thermal, and thermomechanical performances of the demonstrators have been evaluated along with presentations of methodologies of experimental and numerical characterizations. LÄS MER

3. 17. ORMOCER Materials Characterization, LAP- & Micro-Processing : Applied to Optical Interconnects and High-Frequency Packaging

   Författare :Steffen Uhlig; Mats Robertsson; Peter van Daele; Linköpings universitet; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Optical interconnects; Optical Backplanes; ORMOCER; SBU-technology; high-frequency packaging; surface characterization; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik;

   Sammanfattning : ORMOCERR®s are organic-inorganic hybrid polymers. Since their material properties can be tailored precisely during synthesis, they are suitable for a wide range of applications in dielectric and optical microelectronics. LÄS MER

4. 18. Concurrent chip and package design for radio and mixed-signal systems

   Författare :Meigen Shen; Li-Rong Zheng; Shaofang Gong; KTH; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; Elektronik;

   Sammanfattning : The advances in VLSI and packaging technologies enable us to integrate a whole system on a single chip (SoC) or on a package module. In these systems, analog/RF electronics, digital circuitries, and memories coexist. This new technology brings us new freedom for system integration as well as new challenges in system design and implementation. LÄS MER

5. 19. Support for the industrial packaging development process: Buyer and supplier perspectives

   Författare :Sandra Silgård Casell; Förpackningslogistik; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Collaboration; development process; industrial packaging;

   Sammanfattning : Industrial packaging contains the parts of final products and is used in the handling and transport of them from the component supplier to the manufacturing company. An increased interest and emphasis on industrial packaging is necessary if the associated potential benefits in terms of costs, efficiency and effectiveness of packaging related activities are to be realized (related activities are those that have an impact on or are affected by the use of packaging). LÄS MER

7. 20. Fundamental Characterization of Low Dimensional Carbon Nanomaterials for 3D Electronics Packaging

   Författare :Andreas Nylander; Chalmers tekniska högskola; []
   Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Reliability aspects; Graphene; Thermal management; Carbon nanotubes; Electrical interconnects. Thermal interface material; Heat treatment.;

   Sammanfattning : Transistor miniaturization has over the last half century paved the way for higher value electronics every year along an exponential pace known as 'Moore's law'. Now, as the industry is reaching transistor features that no longer makes economic sense, this way of developing integrated circuits (ICs) is coming to its definitive end. LÄS MER