Sökning: "Lead-free solders"

Visar resultat 1 - 5 av 10 avhandlingar innehållade orden Lead-free solders.

  1. 1. Electron microscope investigation of conductive adhesives and lead-free solders

    Författare :Lilei Ye; Chalmers tekniska högskola; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES; intermetallics; microstructure; SEM; lead-free solders; conductive adhesives; TEM; and EFTEM;

    Sammanfattning : .... LÄS MER

  3. 2. Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging

    Författare :Peng Sun; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging; Low Cycle Fatigue; Intermetallic Compounds; Lead-Free Solders; Finite Element Simulation;

    Sammanfattning : Two key technologies used by the electronics industry are chip technology and packaging technology. Solder plays a crucial role in both of them. During the last decade, there has been a strong worldwide environmental movement towards lead-free electronic products. LÄS MER

  4. 3. Reliability, fatigue and mechanical characterization of lead-free solders for electronic packaging applications

    Författare :Cristina Andersson; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Reliability.; Isothermal mechanical fatigue; Tensile tests; Mechanical behavior; Electronics; Thermal fatigue; Lead-free solders; Low cycle fatigue;

    Sammanfattning : The ever increasing amount of electronic waste, most of which ends up in landfills, has become a serious worldwide concern. In addition to this, the fact that Pb is highly toxic and harmful to humans has lead to the ban of this element from the electronics industry. LÄS MER

  5. 4. Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

    Författare :Sun Peng; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Finite Element Simulation; Reliability; Intermetallic Compounds; Lead-free Solder; Low Cycle Fatigue;

    Sammanfattning : Two key technologies in electronics industry are chip technology and packaging technology. Solder plays a crucial role in the assembly and interconnection in the electronic packaging industry. As a joint material, solder provides electronic, thermal and mechanical continuity. LÄS MER

  7. 5. Low cycle fatigue and reliability characterisation of lead free solders

    Författare :Cristina Andersson; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

    Sammanfattning : .... LÄS MER