Sökning: "power splitters"

Visar resultat 1 - 5 av 8 avhandlingar innehållade orden power splitters.

  1. 1. Design and Characterization of SiN-based integrated optical components for Wavelength Division Multiplexing

    Författare :Alexander Caut; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; crosstalk; silicon nitride.; Mach-Zehnder interferometers; polarization; grating couplers; insertion loss; power splitters; arrayed waveguide gratings; silicon photonics;

    Sammanfattning : To follow the trend of the data traffic and to limit the size of the hyperscale data centers, communication solutions offering small footprint, low cost and low power consumption are needed. Optical interconnects used in data centers are mostly short reach (approximately 100 m) based on GaAs-based 850 nm vertical-cavity surface emitting lasers (VCSELs) and OM4 multimode fibers (MMF). LÄS MER

  2. 2. Silicon nitride-based integrated components for optical communication

    Författare :Alexander Caut; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Mach-Zehnder interferometers; grating couplers; insertion loss; silicon photonics; power splitters; polarization; arrayed waveguide gratings; crosstalk; silicon nitride.;

    Sammanfattning : To follow the trend of the data traffic and to limit the size of the hyperscale data centers, communication solutions offering small footprint, low cost and low power consumption are needed. Optical interconnects used in data centers are mostly short reach (approximately 100 m) based on GaAs-based 850 nm vertical-cavity surface emitting lasers (VCSELs) and OM4 multimode fibers (MMF). LÄS MER

  3. 3. Periodic structures and lumped elements in microwave passives

    Författare :Dan Kuylenstierna; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Passive elements; Lumped elements; Photonic bandgap; Metamaterial; MMIC; Electromagnetic bandgap; Ferroelectric; Quadrature hybrid; Quadrature power splitter; Balun; Periodic structures;

    Sammanfattning : The ambition of this work is the incorporation of ferroelectric varactors as tuneable elements in Si integrated circuits (ICs). This thesis presents partialfulfillments of the work. LÄS MER

  4. 4. Design, Simulation and Characterization of Some Planar Lightwave Circuits

    Författare :Yaocheng Shi; Anand Srinivasan; Sailing He; Daniel Erni; KTH; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; planar lightwave circuit; waveguide; coupler; multimode interference; photonic crystal waveguide; de multiplexer; triplexer; polarization beam splitter; dry etching; carrier life time.; Photonics; Fotonik;

    Sammanfattning : Optical devices based on planar lightwave circuit (PLC) technology have the advantages of small size, high reliability, possibility for large scale production, and potential integration with electronics. These devices are widely employed in optical telecommunications, sensing, data storage, imaging, and signal processing. LÄS MER

  5. 5. Technology for photonic components in silica/silicon material structure

    Författare :Lech Wosinski; KTH; []
    Nyckelord :silica-on-silicon technology; PECVD; plasma deposition; photonic integrated circuits; planar waveguide devices; UV Bragg gratings; photosensitivity; arrayed waveguide gratings; multimode interference couplers; add-drop multiplexers;

    Sammanfattning : The main objectives of this thesis were to develop a lowtemperature PECVD process suitable for optoelectronicintegration, and to optimize silica glass composition forUV-induced modifications of a refractive index in PECVDfabricated planar devices. The most important achievement isthe successful development of a low temperature silicadeposition, which for the first time makes it is possible tofabricate good quality low loss integrated components whilekeeping the temperature below 250oC during the entirefabrication process. LÄS MER