Sökning: "Flip-chip"
Visar resultat 16 - 20 av 23 avhandlingar innehållade ordet Flip-chip.
16. Silicon Integrated HBV Frequency Multipliers for THz Applications
Sammanfattning : This thesis deals with integrated varactor diode circuits for terahertz (THz) applications. In particular hybrid, monolithic microwave integrated circuits (MMICs), and heterogeneous integration are explored for frequency multiplier applications. LÄS MER
17. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing
Sammanfattning : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. LÄS MER
18. Bi2212 intrinsic Josephson junctions, fabrication and high frequency properties
Sammanfattning : The objective for this work was to investigate the high-frequency properties of Bi2212 intrinsic Josephson junctions (IJJ’s). Particularly, the possibility to reach the THz range with a SIS mixer is theoretically promising due to the high energy gap of Bi2212. LÄS MER
19. Microwave CMOS VCOs and Front-Ends - using integrated passives on-chip and on-carrier
Sammanfattning : The increasing demand for high data rates in wireless communication systems is increasing the requirements on the transceiver front-ends, as they are pushed to utilize more and wider bands at higher frequencies. The work in this thesis is focused on receiver front-ends composed of Low Noise Amplifiers (LNAs), Mixers, and Voltage Controlled Oscillators (VCOs) operating at microwave frequencies. LÄS MER
20. Microwave CMOS LNAs and VCOs - Using Passives On-Chip, Above Chip, and Off-Chip
Sammanfattning : The performance of LNAs and VCOs is of large importance to the complete wireless communications system. To achieve sufficient performance in microwave applications, LNAs and VCOs have therefore up to now mostly been manufactured in advanced and expensive semiconductor technologies. LÄS MER