Sökning: "Flip-chip"

Visar resultat 6 - 10 av 23 avhandlingar innehållade ordet Flip-chip.

  1. 6. Adhesion Characterization and Reliability Issues of Anisotropic Conductive Adhesives for Microsystem Applications

    Författare :Liqiang Cao; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; adhesion strength; curing degree and curing temperature; moisture effect; flip chip; anisotropic conductive adhesives; reliability;

    Sammanfattning : There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low bonding temperature and fine-pitch capability are the major advantages of conducting adhesive technology. LÄS MER

  3. 7. High frequency properties of electrically conductive adhesive interconnections and multilayer substrates

    Författare :Markus Dernevik; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; microwaves; sequential build-up board; electrically conductive adhesives; flip-chip; printed cirquit board; anisotropic adhesives; multilayer; interconnections; printed wire board; surface mount technology; isotopic adhesives;

    Sammanfattning : .... LÄS MER

  4. 8. VCSEL and Integration Techniques for Wavelength-Multiplexed Optical Interconnects

    Författare :Mehdi Jahed; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; wavelength setting; optical interconnects; mode control; vertical-cavity surface-emitting laser; flip-chip integration; wavelength-division-multiplexing; silicon photonics;

    Sammanfattning : GaAs-based vertical-cavity surface-emitting lasers (VCSELs) are dominating short-reach optical interconnects (OIs) due to their high modulation speed, low power consumption, circular output beam and low fabrication cost. Such OIs provide the high bandwidth connectivity needed for interconnecting servers and switches in data centers. LÄS MER

  5. 9. Stresses and strains in anisotropically conductive adhesive (ACA) flip-chip joints and in semiconductor heterostructures

    Författare :Kuntjoro Pinardi; Chalmers tekniska högskola; []
    Nyckelord :NATURVETENSKAP; NATURAL SCIENCES;

    Sammanfattning : .... LÄS MER

  7. 10. Characterization of RF properties for system-in-a-package and anisotropic conductive adhesive flip- chip inter connection

    Författare :Gang Zou; Chalmers tekniska högskola; []
    Nyckelord :TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

    Sammanfattning : .... LÄS MER